• ICALEO 2006 Paper #M404 (Corrosion Behavior of Laser-Oxidized NiTi in Hanks' Solution)

    Corrosion Behavior of Laser-Oxidized NiTi in Hanks' Solution
    Authors:
    Man Hon Wong, Department of Applied Physics, The Hong Kong Polytechnic University; - Hong Kong
    F.T. Cheng, The Hong Kong Polytechnic University; Hung Hom, Kowloon Hong Kong
    H.C. Man, The Hong Kong Polytechnic University; Hung Hom, Kowloon Hong Kong
    Presented at ICALEO 2006

    NiTi was surface treated with a pulsed Nd:YAG laser to accomplish oxidation without melting. The oxide layer was characterized by transmission electron microscopy (TEM), atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS) to obtain information on the thickness, morphology, and the composition profile. The oxide...

    $28.00

  • ICALEO 2006 Paper #M405 (KrF Excimer Laser Processing of Human Dental Hard Tissues)

    KrF Excimer Laser Processing of Human Dental Hard Tissues
    Authors:
    Rui Vilar, IST; Lisboa Portugal
    Sivakumar Manickam, IST; Lisboa Portugal
    Vitor Oliveira, IST; Lisboa Portugal
    Presented at ICALEO 2006

    Laser surface treatment is a promising technique for applications in dentistry such as the prevention of caries, the reduction of dental hypersensitivity and the improvement of bond strength between dentin and restorative materials. In this study, the morphological and chemical changes of human enamel and dentin surfaces after KrF excimer laser irradiation was characterized by scanning electron microscopy, X-ray diffraction and X-ray photoelectron spectroscopy. For radia...

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  • ICALEO 2006 Paper #M502 (Development of DPSS-Laser-Based ITO Patterning System for Large-Scale FPD's (Invited Paper))

    Development of DPSS-Laser-Based ITO Patterning System for Large-Scale FPD's (Invited Paper)
    Authors:
    Naoaki Fukuda, Hitachi Zosen Corporation; OSAKA Japan
    Presented at ICALEO 2006

    The FPD market continues rapidly growth. The panel manufacturer keeps an effort to increase the manufacturing efficiency, moreover must produce panels in consideration of global environmental concerns more than before. The laser patterning method is thought to be one of processing methods that breaks down the limit of a present manufacturing efficiency and environmental problems. Hitz Hitachi Zosen Co. and Takei electric industries Co., Ltd. have been developing various laser patterning equipments in FPD, semiconducto...

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  • ICALEO 2006 Paper #M503 (Nanoscale Analysis of Laser Ablated Thin Films used in Industrial Manufacturing of Flat Panel Displays)

    Nanoscale Analysis of Laser Ablated Thin Films used in Industrial Manufacturing of Flat Panel Displays
    Authors:
    Jozef Wendland, Powerlase Ltd; Crawley Great Britain
    Matt Henry, Powerlase Limited; West Sussex Great Britain
    Paul Harrison, Powerlase Ltd; Crawley Great Britain
    Presented at ICALEO 2006

    Flat panel display manufacturing has recently been revolutionized by the industrial uptake of laser direct write techniques to replace lithography for patterning active thin films on glass. The use of diode pumped, high average power, nanosecond pulsed, kilohertz repetition rate infrared lasers to directly pattern electrically active thin films on glass substrates has elimina...

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  • ICALEO 2006 Paper #M504 (A Laser Selective Etching Process for Next-Generation Flexible Display)

    A Laser Selective Etching Process for Next-Generation Flexible Display
    Authors:
    Kwang-Ryul Kim, LG Electronics Inc.; Pyungtaek, Kyunggido South Korea
    J. W. Kim, Production Engineering Research Institute, LG Electronics Inc.; Pyungtaek-si South Korea
    Kwangyeol Baek, Production Engineering Research Institute, LG Electronics Inc.; Pyungtaek-si South Korea
    S.C. Oh, Production Engineering Research Institute, LG Electronics Inc.; Pyungtaek-si South Korea
    C.H Cho, Production Engineering Research Institute, LG Electronics Inc.; Pyungtaek-si South Korea
    H. S. Kang, Production Engineering Research Institute, LG Electronics Inc.; Pyungtaek-si South Korea...

    $28.00

  • ICALEO 2006 Paper #M601 (Laser-assisted Microforming with Laser Structured Sapphire Dies)

    Laser-assisted Microforming with Laser Structured Sapphire Dies
    Authors:
    Andreas Ostendorf, Laser Zentrum Hannover e.V.; Hanover Germany
    Jens Wulfsberg, Helmut-Schmidt-University; Hamburg Germany
    Katja Samm, Laser Zentrum Hannover e.V.; Hanover Germany
    Mahdi Terzi, Helmut-Schmidt-University; Hamburg Germany
    Presented at ICALEO 2006

    We report on the development of a novel laser-assisted microforming process for aluminum and stainless steel which makes use of localized 802-nm laser radiation to directly warm the area of the workpiece where the processing is to take place. The procedure makes use of sapphire dies structured using 266, 248 and 193-nm laser rad...

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  • ICALEO 2006 Paper #M602 (Development of Laser Forming of Thin Section Materials Using Rapid Scanning Optics for Macro-Applications)

    Development of Laser Forming of Thin Section Materials Using Rapid Scanning Optics for Macro-Applications
    Authors:
    Konrad Bartkowiak, Fraunhofer Center for Coatings and Laser Appliations; Plymouth MI USA
    Konrad Bartkowiak, Poznan University of Technology; Poznan Poland
    Presented at ICALEO 2006

    Laser Forming (LF) is recognized as a novel technique with strong potential for industrial applications. This non-contact forming method is characterized by having no spring back effect. This very important feature gives LF industrial promise for many applications, especially rapid prototyping, precision adjustment, removing distortion and for generating 3D complex shapes, which can not be ac...

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  • ICALEO 2006 Paper #M604 (Comparative Study of Symmetric and Asymmetric Deformation of Al Single Crystal Under Micro Scale Laser Shock Peening)

    Comparative Study of Symmetric and Asymmetric Deformation of Al Single Crystal Under Micro Scale Laser Shock Peening
    Authors:
    Sinisa Vukelic, Columbia University; New York NY USA
    Youneng Wang, Columbia University; New York NY USA
    Jeffrey Kysar, Columbia University; New York NY USA
    Y. Lawrence Yao, Columbia University; New York NY USA
    Presented at ICALEO 2006

    Laser shock peening by a micron sized laser beam is a process in which compressive residual stresses are induced in order to improve material fatigue life of micro scale components. The size of the laser target interaction zone is of the same order of magnitude as the target material grains and thus th...

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  • ICALEO 2006 Paper #M605 (Waterjet as a Multimode Waveguide - Theoretical and Experimental Investigation of Modal Noise and Beam Propagation in Material Processing with Lasermicrojet)

    Waterjet as a Multimode Waveguide - Theoretical and Experimental Investigation of Modal Noise and Beam Propagation in Material Processing with Lasermicrojet
    Authors:
    Bernold Richerzhagen, Synova SA; Ecublens Switzerland
    Delphine Perrottet, Synova SA; Ecublens Switzerland
    Joseph Battaglia, Sanova-USA; Santa Cruz CA USA
    Tuan Anh Mai, Synova SA; Ecublens Switzerland
    Presented at ICALEO 2006

    Waterjets can be used as light waveguides due to the total internal reflection at the water-air interface. As the diameter of the jet is large compared to the laser wavelength, the jet is comparable to a multimode fiber. In this article the propagation and the intensity di...

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  • ICALEO 2006 Paper #M606 (Laser Fabrication of Silicon Carbide Light Emitting Diodes)

    Laser Fabrication of Silicon Carbide Light Emitting Diodes
    Authors:
    Aravinda Kar, CREOL, University of Central Florida; Orlando FL USA
    Nathaniel Quick, Applicote Associates, LLC; Sanford, FL USA
    Sachin Bet, MMAE/CREOL, University of Central Florida; Orlando FL USA
    Presented at ICALEO 2006

    With the shrinkage in the size of the semiconductor devices, greater shift has been observed towards use of lasers, electron and x-ray beams and advanced optics for small area device fabrication. A novel laser direct-write doping and metallization technique provides a single step approach for processing wide bandgap materials for electronic and optoelectronic device applications, wh...

    $28.00

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