• ICALEO 2008 Paper #1909 (Computer Simulation of Laser Material Removal: Measuring the Depth of Penetration in Laser Engraving)

    Computer Simulation of Laser Material Removal: Measuring the Depth of Penetration in Laser Engraving
    Authors:
    Hamidreza Karbasi, Conestoga College; Kitchener ON Canada
    Presented at ICALEO 2008

    Laser engraving is becoming an appealing option for those applications where previously Electrical Discharge Machining (EDM) was the only choice because of its advantages with practicability, time and cost. Laser engraving technology removes material in a layer-by-layer fashion and the thickness of layers is usually in the range of a few microns and it is depending on several parameters such as the specimen material, laser power, Transverse Electromagnetic Mode (TEM), and beam traverse speed. The crucial ...

    $28.00

  • ICALEO 2008 Paper #2001 (Determination of Optimal Focal Position during CO2 Laser Cutting of Mdfb Thick Sheets to Reduce Side Kerf Curvature)

    Determination of Optimal Focal Position during CO2 Laser Cutting of Mdfb Thick Sheets to Reduce Side Kerf Curvature
    Authors:
    Francisco Letellier, Pontificia Universidad Católica de Chile; Santiago Chile
    Jorge Ramos-Grez, Pontificia Universidad Católica de Chil; Santiago Chile
    Presented at ICALEO 2008

    Wood products such as MDFB (medium density fiberboard) have become extensively used today in the furniture and sign industries among other applications. CO2 laser cutting of MDFB has also been successfully applied due to the fast cut speed response of the process. Nonetheless, laser cutting of MDFB having thickness greater than 8 mm, keeping focal position fixed at the surface of th...

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  • ICALEO 2008 Paper #2002 (CO2 Laser with Self-filtering Unstable Resonator Applied for Cutting)

    CO2 Laser with Self-filtering Unstable Resonator Applied for Cutting
    Authors:
    Victor Shulyatyev, Instituteof Theoretical and Applied Mechanics, Russian Academy of Sciences; Novosibirsk Russia
    Anatoly Orishich, Instituteof Theoretical and Applied Mechanics, Russian Academy of Sciences; Novosibirsk Russia
    Alexander Malikov, Instituteof Theoretical and Applied Mechanics, Russian Academy of Sciences; Novosibirsk Russia
    Gennady Grachev, Institute of Laser Physics SB RAS; Novosibirsk Russia
    Sergei Trashkeev, Institute of Laser Physics SB RAS; Novosibirsk Russia
    Pavel Statsenko, Institute of Laser Physics SB RAS; Novosibirsk Russia
    Presented at I...

    $28.00

  • ICALEO 2008 Paper #2003 (Thermal and Stress Characteristics in Diode Laser Chip-free Cutting of Glass)

    Thermal and Stress Characteristics in Diode Laser Chip-free Cutting of Glass
    Authors:
    Salman Nisar, The Univeristy of Manchester; Manchester Great Britain
    Farhan Nazir, The Univeristy of Manchester; Manchester Great Britain
    Lin Li, The Univeristy of Manchester; Manchester Great Britain
    M. A Sheikh , The University of Manchester; Manchester Great Britain
    Presented at ICALEO 2008

    In the laser cleaving of brittle materials using controlled fracture technique, thermal stresses are used to induce the crack and the material is separated along the cutting path by extending the crack. In this study, the glass sheet is stressed thermally using a 808-940 nm diode l...

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  • ICALEO 2008 Paper #2004 (Influence of Assist Gas in Fibre Laser Cutting of Aluminum-Copper Alloy)

    Influence of Assist Gas in Fibre Laser Cutting of Aluminum-Copper Alloy
    Authors:
    Antonio Riveiro, Universidade De Vigo; Vigo Spain
    Felix Quintero, Universidade De Vigo; Vigo Spain
    Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
    Fernando Lusquis, Universidade De Vigo; Vigo Spain
    Juan Pou, Universidade de Vigo; Vigo Spain
    Veli Kujanpaa, Lappeenranta University of Technology; Lappeenranta Finland
    Presented at ICALEO 2008

    Fibre laser cutting is an emerging field in laser materials processing. This new generation of high power solid state lasers offers a lot of advantages as compared to traditional lasers...

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  • ICALEO 2008 Paper #2005 (Remote Cutting - A Smart Solution using the Advantages of High Brightness Lasers)

    Remote Cutting – A Smart Solution using the Advantages of High Brightness Lasers
    Authors:
    Matthias Luetke, University of Technology Dresden; Dresden Germany
    Achim Mahrle, University of Technology Dresden; Dresden Germany
    Thomas Himmer, Fraunhofer Iws; Dresden Germany
    Lothar Morgenthal, Fraunhofer Iws; Dresden Germany
    Eckhard Beyer, Fraunhofer Iws and University of Technology Dresden; Dresden Germany
    Presented at ICALEO 2008

    Laser cutting plays a huge role in the field of laser materials processing. A high beam quality, a high laser power and a high absorption rate are the important ones in order to reach high cutting rates in combination wit...

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  • ICALEO 2008 Paper #2006 (Theoretical Aspects of the Process Efficiency in Laser Beam Cutting with Fiber Lasers)

    Theoretical Aspects of the Process Efficiency in Laser Beam Cutting with Fiber Lasers
    Authors:
    Achim Mahrle, TU Dresden; Dresden Germany
    Eckhard Beyer, Fraunhofer IWS and TU Dresden; Dresden Germany
    Florian Bartels, Fraunhofer IWS; Dresden Germany
    Presented at ICALEO 2008

    Fiber lasers offer distinct advantages over established laser technology with respect to power efficiency, beam guidance and beam quality. Consequently, the potential of these new laser beam sources will be increasingly exploited also for laser cutting applications that are conventionally carried out with CO2 lasers. However, theoretical estimates of the effective absorptivity at the cut front suggest...

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  • ICALEO 2008 Paper #2007 (Fiber Laser Processing of Thick Yttria Stabilized Zirconia)

    Fiber Laser Processing of Thick Yttria Stabilized Zirconia
    Authors:
    Jon Parry, Heriot Watt University; Edinburg USA
    Fraser Dear, Heriot Watt University; Edinburgh Great Britain
    Jon Shephard, Heriot Watt University; Edinburgh Great Britain
    Rehan Ahmed, Heriot Watt University; Edinburgh Great Britain
    Duncan Hand, Heriot Watt University; Edinburgh Great Britain
    Presented at ICALEO 2008

    A novel laser processing technique is demonstrated for cutting up to 13mm thick sections of Yttria-stabilized Tetragonal Zirconia Polycrystal (Y-TZP) ceramic. Y-TZP is a high toughness engineering ceramic which is extremely difficult to machine in its final state...

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  • ICALEO 2008 Paper #201 (Modulation Techniques for Enhanced Materials Processing using a Sm Fiber Laser)

    Modulation Techniques for Enhanced Materials Processing using a Sm Fiber Laser
    Authors:
    Mohammed Naeem, GSI Group, Inc. - Laser Division; Rugby Great Britain
    Steve Keen, Gsi Group; Warwickshire Great Britain
    Presented at ICALEO 2008

    High average power is not always the answer for laser material processing. Processing speeds can be increased with more average power however; there is no gain in efficiency meaning that costs and/ or distortion can be greatly increased. A better solution would be to get more from the laser output i.e. a more efficient beam- material interaction. In recent years, GSI Group, Laser Division has undertaken a number of research initiatives to optimize lamp ...

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  • ICALEO 2008 Paper #202 (Current Status and Most Recent Developments of Industrial High Power Disk Lasers)

    Current Status and Most Recent Developments of Industrial High Power Disk Lasers
    Authors:
    Ruediger Brockmann, Trumpf Laser Gmbh & Co. Kg; Schramberg Germany
    Thomas Schwoerer, Trumpf Laser & Co. Kg; Schramberg Germany
    Alexander Killi, TRUMPF Laser GmbH & Co. KG; Schramberg Germany
    David Havrilla, TRUMPF Inc.; Plymouth MI USA
    Presented at ICALEO 2008

    The disk laser concept aggregates high efficiency, excellent beam quality, high average and peak power with moderate cost and high reliability. Therefore it became one major technology in industrial laser material processing. In several large scale installations in the automotive industry, high power cw- systems...

    $28.00

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