• ICALEO 2008 Paper #P147 (Laser Removal of Nanosized Particles from a Silicon Wafer using Green Laser)

    Laser Removal of Nanosized Particles from a Silicon Wafer using Green Laser
    Authors:
    HOON JEONG, Korea Institute of Industrial Tech; Cheonansi South Korea
    Jae Dong Song, Kitech; Cheonan South Korea
    Ji Young Baek, Kitech; Cheonan South Korea
    Kang Won Lee, Kitech; Cheonan South Korea
    Myong Hwa Lee, Kitech; Cheonan South Korea
    Sang Bum Kim, Kitech; Cheonan South Korea
    Kyung Soo Kim, Kitech; Cheonan South Korea
    Presented at ICALEO 2008

    As semiconductor device technology moves toward higher densities and smaller dimensions, a wafer surface cleaning of sub-100 nm sized particles becomes one of the most important proces...

    $28.00

  • ICALEO 2008 Paper #P149 (Development of a Time Resolved Energy Absorption Measurement Technique for Laser Beam Spot Welds)

    Development of a Time Resolved Energy Absorption Measurement Technique for Laser Beam Spot Welds
    Authors:
    C.V. Robino, Sandia National Laboratory; Albuquerque NM USA
    J.T. Norris, Sandia National Laboratories; Albquerque NM USA
    Presented at ICALEO 2008

    A method is currently being developed to temporally characterize the energy absorption in laser beam spot welds. As a spot weld is created, absorption of laser energy changes with the condition of the weld (initial melting conduction keyhole). By relating the known pulse energy to the energy scattered during welding, a time resolved description of energy absorption can be determined. The method discussed uses a gold plated i...

    $28.00

  • ICALEO 2008 Paper #P150 (Femtosecond Laser Micro-Patterning of Diamond Films for Device Fabrication)

    Femtosecond Laser Micro-Patterning of Diamond Films for Device Fabrication
    Authors:
    Matthew Parrish, University of Tennessee Space Institute; USA
    Yelena White, University of Tennessee Space Institute; Tullahoma TN USA
    Lloyd Davis, University of Tennessee Space Institute; Tullahoma TN USA
    Zbigniew Sikorski, University of Tennessee Space Institute; Tullahoma TN USA
    Richard Thompson, University of Tennessee Space Institute; Tullahoma TN USA
    William Hofmeister, University of Tennessee Space Institute; Tullahoma TN USA
    Presented at ICALEO 2008

    Diamond has a tremendous potential for device applications due to its unique superlative ma...

    $28.00

  • ICALEO 2008 Paper #P153 (Heterogeneous Surface Layer Modification by High Concentrated Energy Source for Tribological Applications)

    Heterogeneous Surface Layer Modification by High Concentrated Energy Source for Tribological Applications
    Authors:
    Norbert Radek, Technical University of Kielce; Kielce Poland
    Konrad Bartkowiak, Fraunhofer IWS; Dresden Germany
    Steffen Mueller, Fraunhofer Usa; Plymouth MI USA
    Presented at ICALEO 2008

    Numerous research centres all over the world are involved in the study of laser surface modification. By controlling laser parameters such as the amount of power, scanning speed, and pulse duration, it is possible to form coatings with different surface properties, including surface geometry, microhardness, stress states or resistance to wear. One of the cheapest and commo...

    $28.00

  • ICALEO 2008 Paper #P154 (Real-time Spectrographic Analysis of the Melt Pool During Direct Laser Deposition Process)

    Real-time Spectrographic Analysis of the Melt Pool During Direct Laser Deposition Process
    Authors:
    Konrad Bartkowiak, Fraunhofer IWS; Dresden Germany
    Steffen Mueller, Fraunhofer Usa; Plymouth MI USA
    Presented at ICALEO 2008

    Direct Laser Deposition (DLD) method is relatively new technology which has significantly matured in last few years. Although this technique has been well know from the mid 80s, process control is still under investigation. The major application of DLD is in the repair or modification of existing parts or the manufacture of completely new 2-D or 3-D parts. This technology is also commonly used for the addition of special surface layer qualities on a base mate...

    $28.00

  • ICALEO 2008 Paper #P155 (Laser Assisted Machining of Aluminum Composite Reinforced by Sic Particle)

    Laser Assisted Machining of Aluminum Composite Reinforced by Sic Particle
    Authors:
    D. Przestacki, Poznan Univesity of Technology; Poznan Poland
    M. Kawalec, Poznan Univesity of Technology; Poznan Poland
    K. Bartkowiak, Fraunhofer IWS; Dresden Germany
    M. Jankowiak, Poznan Univesity of Technology; Poznan Poland
    Steffen Mueller, Fraunhofer Usa; Plymouth MI USA
    Presented at ICALEO 2008

    Metal matrix composites (MMCs) have many industry applications in different sectors, e.g.: automobile and aerospace. However, due to hard ceramic reinforcing components in MMCs, difficulties can arise when machining via conventional manufacturing processes. Heavy tool...

    $28.00

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