ICALEO 2005 Paper #P513 (Laser Processing of Solder Prevention Coating)
Laser Processing of Solder Prevention Coating
Authors:
Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
Tony Vesterinen, Lappeenranta University of Technology; Lappeenranta Finland
Presented at ICALEO 2005
The last work phase of PCB manufacture prior installation of components is to remove the solder prevention paint and to reveal the positions in which the components will be connected. Traditionally this is carried out with etching, which is a chemical process. This work concentrates on removal of this coating with laser processing. Different lasers were tested in this task and laser showed to be accurate, flexible and fast tool for doing this work. Nd:Y...$28.00
ICALEO 2005 Paper #P510 (Residual Stresses in HPDL and Nd:YAG Laser Cladded Coatings)
Residual Stresses in HPDL and Nd:YAG Laser Cladded Coatings
Authors:
Jari Tuominen, Tampere University of Technology, Institute of Materials Science; Tampere Pirkanmaa Finland
Petri Vuoristo, Tampere University of Technology, Institute of Materials Science; Tampere Pirkanmaa Finland
Tapio MylTampere University of Technology, Institute of Materials Science; Tampere Pirkanmaa Finland
Presented at ICALEO 2005
Applying laser cladded components in expensive machines and engines requires knowledge of residual stresses in order to avoid unexpected failures and further damages. Normally residual stresses induced by laser cladding are highly tensile due to strong thermal ...$28.00
ICALEO 2005 Paper #P508 (Corrosion Properties of Thermally Sprayed In-Situ Laser Remelted Ni-Based Coatings)
Corrosion Properties of Thermally Sprayed In-Situ Laser Remelted Ni-Based Coatings
Authors:
Jyrki Suutala, Tampere University of Technology; Tampere Finland
Jari Tuominen, Tampere University of Technology; Tampere Pirkanmaa Finnland
Petri Vuoristo, Tampere University of Technology; Tampere Finland
Presented at ICALEO 2005
In the present study, surface engineering research related to thermally sprayed Ni-based corrosion resistant coatings modified by in-situ and post treatment by novel high power lasers (Nd:YAG and diode lasers) has been carried out. The main aim of the study was to create experimental based information and knowledge on simultaneous remelting of thermal...$28.00
ICALEO 2005 Paper #P507 (Laser Surface Melting of High-Speed Steels for Enhancing Surface Properties)
Laser Surface Melting of High-Speed Steels for Enhancing Surface Properties
Authors:
Hau Chung Man, Laser Processing Group, Advanced Manufacturing Technology Research Centre; Kowloon Hong Kong
Presented at ICALEO 2005
Two high-speed steels (HSS), ASP23 and ASP30 formed by powder metallurgy, have similar chemical compositions (Fe-4.2wt%Cr-6.4wt%W-5wt%Mo-3.1wt%V-1.3wt%C), but with ASP30 containing 8.5% Co, were surface remelted by a 2.5-kW Nd:YAG laser. Metallographical, X-ray diffraction, microhardness, as well as electrochemical corrosion studies illustrate the beneficial effects of laser surface melting (LSM) in enhancing the surface properties of the HSS. The laser-melted zone of the HSS cons...$28.00
ICALEO 2005 Paper #P501 (Studies of Frequency-Tripled Nd:YAG Laser in Laser Structuring Process)
Studies of Frequency-Tripled Nd:YAG Laser in Laser Structuring Process
Authors:
Bin Zhang, Hong Kong Poly University; Hong Kong
K.C. Yung, Hong Kong Poly University; Hong Kong
Presented at ICALEO 2005
With the increasing demand for finer lines/spaces on PCB boards, a new technology ?laser structuring ? has emerged in recent years. In this research, the frequency-tripled Nd:YAG laser is selected as the laser source in laser structuring; this laser is often used in miniaturization machining. This paper describes in detail the processing parameters? influences of lasers and etching process, such as laser power, repetitions, repetition rate, bite size and etching time, on laser st...$28.00
ICALEO 2005 Paper #M808 (Direct-patterning of Silicon Carbide by Nanosphere-Assisted Pulsed Laser)
Direct-patterning of Silicon Carbide by Nanosphere-Assisted Pulsed Laser
Authors:
Arvind Battula, University of Texas at Austin; Austin TX USA
Senthil Theppakuttai, The University of Texas at Austin; Austin TX USA
Shaochen Chen, The University of Texas at Austin; Austin TX USA
Presented at ICALEO 2005
Optical near-field enhancement obtained between the spheres and substrate by irradiating with laser beam can be used for nano-patterning the hard-to-machine bulk silicon carbide (SiC). For this study a monolayer of silica (SiO2) spheres of 1.76 micorn and 640 nm diameter are deposited on the SiC substrate and then irradiated with an Nd:YAG laser of wavelength 355 nm and 5...$28.00
ICALEO 2005 Paper #M807 (Laser Exposure System for Flat Panel Display Industry)
Laser Exposure System for Flat Panel Display Industry
Authors:
Kim Kwang-Ryul, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Yong-Woo Lee, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Hye-Won Kim, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
In-Tae Park, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Hyoung-Shik Kang, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Sang-Bong Lee, LG Electronics Inc.
LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Soon-Kook Hong, LG Electronics Inc.; Pyungtaek, Kyunggido Korea
Presented at ICALEO 2005
When screen size of the Flat Panel Display (FPD) becomes larger, the tradit...$28.00
ICALEO 2005 Paper #M804 (Cutting Flexible Printed Circuit Board with a 532nm Q-Switched Diode Pumped Solid State Laser)
Cutting Flexible Printed Circuit Board with a 532nm Q-Switched Diode Pumped Solid State Laser
Authors:
Matt Henry, Powerlase Ltd; Crawley Great Britain
Jozef Wendland, Powerlase Ltd; Crawley West Sussex UK
Paul Harrison, Powerlase Ltd; Crawley West Sussex UK
Duncan Parsons-Karavassilis, Powerlase Ltd; Crawley West Sussex UK
Presented at ICALEO 2005
The authors investigate the high speed laser cutting of flexible printed circuit boards (PCBs) using a low M2 532nm to create features >40 microns in size.
The use of flexible PCBs in portable electronics devices such as laptops, PDAs and mobile phones is increasing as such material offers advantages in terms o...$28.00
ICALEO 2005 Paper #M803 (Two-Dimensional Transient Modeling of CO2 Laser Drilling of Microvias in High Density Flip Chip Substrates)
Two-Dimensional Transient Modeling of CO2 Laser Drilling of Microvias in High Density Flip Chip Substrates
Authors:
Chong Zhang, Univ. of Central Florida, CREOL; Orlando Florida USA
Islam Salama, Intel-Assembly and Technology Development; Chandler AZ USA
Nathaniel Quick, AppliCote Associates LLC; Orlando FL USA
Aravinda Kar, Univ. of Central Florida, CREOL; Orlando Florida USA
Presented at ICALEO 2005
Thermal modeling is essential to understand the laser-materials interactions and to control CO2 laser drilling of blind microvias (< 50 um) through polymeric dielectric in multilayer electronic substrates. In order to understand the profile of the drilling fr...$28.00
ICALEO 2005 Paper #M802 (Laser Microtechnologies for Passive Elements of Electronic Circuits)
Laser Microtechnologies for Passive Elements of Electronic Circuits
Authors:
Ryszard Pawlak, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Franciszek Kostrubiec, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Maria Walczak, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Mariusz Tomczyk, Technical University of Lodz, Division of Materials Science & Electrotechnology; Lodz Poland
Presented at ICALEO 2005
Varied innovative laser-technologies introduced to manufacturing process of electronic circuits and devices were applie...$28.00
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