ICALEO 2009 Paper #M602 (A Comparison of Cut Path Deviation with Continuous and Pulsed Beam Modes in Diode Laser Chip-free Cutting of Glass)
A Comparison of Cut Path Deviation with Continuous and Pulsed Beam Modes in Diode Laser Chip-free Cutting of Glass
Authors:
Salman Nisar, The University of Manchester; Manchester Great Britain
Lin Li, The University of Manchester; Manchester Great Britain
M.A. Sheikh, The University of Manchester; Manchester Great Britain
Andrew J Pinkerton, The University of Manchester; Manchester Great Britain
Presented at ICALEO 2009
During laser cleaving of brittle materials with the controlled fracture technique, thermal stresses are generated. These induce the crack to form and extend it along the cutting path, which subsequently causes material separation. The fract...$28.00
ICALEO 2009 Paper #M603 (Influence of Polarization Plane on Groove Shape in Scribing of Sapphire by THG:YAG Laser)
Influence of Polarization Plane on Groove Shape in Scribing of Sapphire by THG:YAG Laser
Authors:
Yasuhiro Okamoto, Okayama University; Okayama Japan
Tomokazu Sakagawa, Kataoka Corporation; Yokohama Japan
Yoshiyuki Uno, Okayama University; Okayama Japan
Yutaka Mukoya, Okayama University; Okayama Japan
Yuki Okamura, Okayama University; Okayama Japan
Presented at ICALEO 2009
Scribing characteristics of mono-crystalline sapphire by using THG:YAG laser of 355nm in wavelength were investigated. The influence of polarization plane of laser beam on the curved shape at the tip of groove was also discussed. Moreover, the reflection of laser beam was ex...$28.00
ICALEO 2009 Paper #M604 (Effect of Grain Size on the Laser Machinability of Alumina)
Effect of Grain Size on the Laser Machinability of Alumina
Authors:
Michael Furlan, Queen\'S University; Kingston ON Canada
Gene Zak, Queen\'S University; Kingston ON Canada
Presented at ICALEO 2009
The effect of grain size on the laser machinability of alumina (Al2O3) was examined in order to meet the demand of higher tolerances when laser machining advanced ceramics. Laser lines created in alumina samples fabricated by using progressively increasing sintering times showed a difference in the amount of damage produced along the edges of the channels that were created, with less damage in smaller-grained samples. The average line width of the samples decreased with increasing grai...$28.00
ICALEO 2009 Paper #M701 (Rapid Prototyping Process Based on the Use of an Intelligent Pinhole Mask and 193 nm Excimer Laser Used to Fabricate Polymer Microfluidic Devices)
Rapid Prototyping Process Based on the Use of an Intelligent Pinhole Mask and 193 nm Excimer Laser Used to Fabricate Polymer Microfluidic Devices
Authors:
Kevin Conlisk, National Centre for Laser Applications, National Univ. of Ireland; Galway Ireland
Richard Sherlock, National Centre for Laser Applications, National Univ. of Ireland; Galway Ireland
Gerard M. O'Connor, National Centre for Laser Applications, National Univ. of Ireland; Galway Ireland
Thomas J. Glynn, National Centre for Laser Applications, National Univ. of Ireland; Galway Ireland
Presented at ICALEO 2009
Laser use for rapid prototyping of microfluidic devices has proven useful but can have...$28.00
ICALEO 2009 Paper #M702 (Fabrication of High-resolution Conducting Pattern on Polyvinylidene Fluoride Substrates by KrF Excimer Laser)
Fabrication of High-resolution Conducting Pattern on Polyvinylidene Fluoride Substrates by KrF Excimer Laser
Authors:
Ying Liu, Beijng University of Technology; Beijing China Peoples Republic of China
Yijian Jiang, Beijing University of Technology; Beijing China Peoples Republic of China
Presented at ICALEO 2009
This paper describes using KrF excimer laser for fabricating conducting graph on Polyvinylidene fluoride (PVDF) substrates. Any graph is machined by direct laser writing technique. Furthermore, the defect structure is prepared on this patterned surface where laser etching is carried out. Mask patterning is used to select the conducting area when the patterned sample is irra...$28.00
ICALEO 2009 Paper #M703 (Laser Assisted Manufacturing of Microscale Chemical Device of tt Reactor)
Laser Assisted Manufacturing of Microscale Chemical Device of tt Reactor
Authors:
Marika Hirvimaki, Lappeenranta University of Technology, Laser Processing Research Group (Laboratory of Welding Technology and Laser Processing), Lappeenranta, Finland; Lappeenranta Finland
Heidi Piili, Lappeenranta University of Technology, Laser Processing Research Group (Laborato; Lappeenranta Finland
Matti Manninen, Lappeenranta University of Technology; Lappeenranta Finland
Eero Kolehmainen, Lappeenranta University of Technology, Laboratory of Product and Process Development, Lut Chemistry, Faculty of Technology, Lappeenranta, Finland; Lappeenranta Finland
Antti Salminen, Lap...$28.00
ICALEO 2009 Paper #M705 (Micropatterning and Characterization of Electrospun PCL/Gelatin Nanofiber Tissue Scaffolds by Femtosecond Laser Ablation)
Micropatterning and Characterization of Electrospun PCL/Gelatin Nanofiber Tissue Scaffolds by Femtosecond Laser Ablation
Authors:
Yong Chae Lim, Ohio State University; Columbus OH USA
Jed Johnson, Ohio State University; Columbus OH USA
Zhengzheng Fei, Ohio State University; Columbus, OH USA
Dave Farson, The Ohio State University; Columbus OH USA
John J. Lannutti, Ohio State University; Columbus OH USA
Hae Woon Choi, KeiMyoung University; Daegu South Korea
L. James Lee, Ohio State University; Columbus OH USA
Presented at ICALEO 2009
PCL/gelatin is a biodegradable polymer blend with good biocompatibility, mechanical, p...$28.00
ICALEO 2009 Paper #M706 (Analysis and Application of Micro Shockwave Adjustment using Ultrashort Laser Pulses)
Analysis and Application of Micro Shockwave Adjustment using Ultrashort Laser Pulses
Authors:
Peter Bechtold, Chair of Photonic Technologies; USA
Stephan Roth, Bayerisches Laserzentrum GmbH; Erlangen Germany
Michael Schmidt, Friedrich-Alexander-University, Bayerisches Laserzentrum GmbH; Erlangen Germany
Presented at ICALEO 2009
Micro shockwave adjustment is a process mechanism which can be used for highly precise actuator adjustment with bending angle accuracies exceeding 100 nrad in any material. The specific interaction between focussed ultrashort laser pulse and irradiated material allows inducing this process mechanism by ablation with high pulse energy. Within th...$28.00
ICALEO 2009 Paper #M801 (Additive Laser Manufacturing of Small Metallic Components by Laser Micro-Cladding)
Additive Laser Manufacturing of Small Metallic Components by Laser Micro-Cladding
Authors:
S. Sankare, Irepa Laser; Illkirch France
Didier Boisselier, Irepa Laser; Illkirch France
Th. Engel, Laboratorie des Systemes Photoniques; Strasbourg France
F. Hlawka, LGECO-GLISS; Strasbourg France
Presented at ICALEO 2009
Thanks to its long experience in the field of laser processing, IREPA LASER has developed tools adapted to the rapid manufacturing of small metallic parts based on its patent on a coaxial powder cladding nozzle. The process consists in the deposition of melted powders in a melt pool in order to build 3D part or to cover small surfaces with metallic...$28.00
ICALEO 2009 Paper #M802 (Laser Micro Sintering - Upgrade Technology)
Laser Micro Sintering - Upgrade Technology
Authors:
André Streek, University of applied science Mittweida; Mittweida Germany
Peter Regenfuss, University of Applied Science Mittweida; Mittweida Germany
Robby Ebert, University of Applied Science Mittweida; Mittweida Germany
Horst Exner, University of Applied Science Mittweida; Mittweida Germany
Presented at ICALEO 2009
Laser micro sintering is a technology that has proved suitable for the generative production of bodies with structural resolutions down to 25µm. It is a modification of selective laser sintering, a freeform technology for the generation of three-dimensional parts by repeatedly coating thin p...$28.00