• ICALEO 2009 Paper #M209 (MOPA Pulsed Fiber Laser with Controlled Peak Power and Pulse Energy for Micromachining of Hard Materials)

    MOPA Pulsed Fiber Laser with Controlled Peak Power and Pulse Energy for Micromachining of Hard Materials
    Authors:
    Sami Hendow, Multiwave Photonics; - USA
    João Sousa, Multiwave Photonics; Maia Portugal
    Paulo Guerreiro, Multiwave Photonics; Maia Portugal
    Niels Schilling, Fraunhofer Institute IWS Dresden; Dresden Germany
    Jan Rabe, Fraunhofer Institute IWS Dresden; Dresden Germany
    Presented at ICALEO 2009

    Control of pulse parameters, such as pulse energy, peak power and pulse length, is important for optimizing the lasers parameter, as well as identifying the processing window of many hard materials. Examples of such materials are thin film c...

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  • ICALEO 2009 Paper #M301 (Laser Internal Modification plus Wet Etching for Micro-structuring Crystalline and Glassy Materials (Invited Presentation, 40 minutes))

    Laser Internal Modification plus Wet Etching for Micro-structuring Crystalline and Glassy Materials (Invited Presentation, 40 minutes)
    Authors:
    Shigeki Matsuo, The University of Tokushima; Tokushima Japan
    Presented at ICALEO 2009

    Thanks to the recent progress in femtosecond (fs) laser technology, now fs laser is regarded as a powerful tool for micro/nano processing of materials. We apply fs lasers to three-dimensional (3D) removal processing inside transparent solid. The procedure of this processing consists of two steps. The first step is irradiation of focused fs pulses, which results in a modification of host material in the vicinity of the focus. By moving the sample, modified spots are...

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  • ICALEO 2009 Paper #M302 (Micro Structuring of Sapphire and Fused Silica by High Speed and High Precision In-volume Selective Laser Etching)

    Micro Structuring of Sapphire and Fused Silica by High Speed and High Precision In-volume Selective Laser Etching
    Authors:
    Martin Hermans, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
    Jens Gottmann, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
    Maren Hoerstmann-Jungemann, Lehrstuhl Fuer Lasertechnik Rwth Aachen University; Aachen Germany
    Philipp Kramer, Lehrstuhl fur Lasertechnik, RWTH Aachen University; Aachen Germany
    Presented at ICALEO 2009

    Micro structuring of sapphire and fused silica is an important market e.g. the production of microfluidic devices and sensors that combine optical and microfluidic functions...

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  • ICALEO 2009 Paper #M303 (Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical-Laser Etching Method in KOH with the Use of Fiber Laser)

    Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical–Laser Etching Method in KOH with the Use of Fiber Laser
    Authors:
    Adam Rosowski, Technical University of Lodz; Lodz Poland
    Heidi Piili, Lappeenranta University of Technology; Lappeenranta Finland
    Ryszard Pawlak, Technical University of Lodz; Lodz Poland
    Veli Kujanpaa, Lappeenranta University of Technology and VTT; Lappeenranta Finland
    Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
    Presented at ICALEO 2009

    This study presents a hybrid technology of chemical and laser spatial processing (HCL) for spatial micro-processing of monocrystalline sili...

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  • ICALEO 2009 Paper #M304 (Debris-free Low-stress Laser Dicing for Multi-layered MEMS Wafer)

    Debris-free Low-stress Laser Dicing for Multi-layered MEMS Wafer
    Authors:
    Masayuki Fujita, Institute for Laser Technology; Osaka Japan
    Yusaku Izawa, Institute of Laser Engineering, Osaka University; Suita Japan
    Yosuke Tsurumi, Institute of Laser Engineering, Osaka University; Suita Japan
    Shuji Tanaka, Tohoku University; Sendai Japan
    Hideyuki Fukushi, Tohoku University; Sendai Japan
    Keiichi Sueda, Institute of Laser Engineering, Osaka University; Suita Japan
    Yoshiki Nakata, Institute of Laser Engineering, Osaka University; Suita Japan
    Noriaki Miyanaga, Institute of Laser Engineering, Osaka University; Suita Japan
    <...>

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  • ICALEO 2009 Paper #M305 (Analytical Model for CW-Laser Cleaving of Semiconductors)

    Analytical Model for CW-Laser Cleaving of Semiconductors
    Authors:
    Viktor Schütz, Laser Zentrum Hannover e.V.; Hannover Germany
    Oliver Haupt, Laser Zentrum Hannover e.V.; Hannover Germany
    Rainer Kling, Laser Zentrum Hannover e.V.; Hannover Germany
    Presented at ICALEO 2009

    The cw-laser cleaving process strongly depends on the temperature rise in the semiconductor and therefore from the active and passive process parameters. In the past, various methods have been developed to evaluate the process parameters in cw-laser processing of materials. The finite element method is a powerful tool for simulating heat conduction for all kinds of geometries, however, it turns out to...

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  • ICALEO 2009 Paper #M307 (Rapid Prototyping of Microchannels into Silicon with a Femtosecond Fiber Laser)

    Rapid Prototyping of Microchannels into Silicon with a Femtosecond Fiber Laser
    Authors:
    Dong Hyuck Kam, CLAIM, The University of Michigan; Ann Arbor MI USA
    Jyoti Mazumder, Clpam, the University of Michigan; Ann Arbor MI USA
    Presented at ICALEO 2009

    We report on rapid prototyping of microchannels into silicon wafer with a femtosecond pulsed laser. The microchannel is a basic component composing microfludic structures for biomedical applications. In development of such micro-fluidic structures, the mask-less laser direct writing will reduce time and cost as a tool for rapid prototyping compared with the conventional photolithography based technique. While fs ablation ends to be more ...

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  • ICALEO 2009 Paper #M308 (Laser Micro Processing of Metal and Silicon Using 100Khz and 2Mhz Ultrafast Lasers)

    Laser Micro Processing of Metal and Silicon Using 100Khz and 2Mhz Ultrafast Lasers
    Authors:
    John Lopez, Alphanov; Talence France
    Charly Loumena, Alphanov; Talence France
    Victor Archambault, Alphanov; Talence France
    Yoann Zaouter, Amplitude Systemes; Pessac France
    Alexandre Trisorio, Amplitude Systemes; Pessac France
    Marc Faucon, Alphanov; Talence France
    Eric Mottay, Amplitude Systemes; Pessac France
    Presented at ICALEO 2009

    Ultrafast laser micromachining has been widely proven to be a high quality, high flexibility process, with numerous potential, industrial applications. Indeed, femtosecond laser is a key technology...

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  • ICALEO 2009 Paper #M402 (Advances in Laser Based Joining Processes of Micro-Devices using Localised Heating)

    Advances in Laser Based Joining Processes of Micro-Devices using Localised Heating
    Authors:
    Norbert Lorenz, Heriot-Watt University; Edinburgh Great Britain
    Martin D. Smith, Heriot-Watt University; Edinburgh
    Suzanne Millar, Heriot-Watt University; Edinburgh Great Britain
    Marc Desmulliez, Heriot-Watt University; Edinburgh
    Duncan P. Hand, Heriot-Watt University; Edinburgh Great Britain
    Presented at ICALEO 2009

    One of the remaining issues in the fabrication of micro-devices, including MEMS, is the packaging process. Standard techniques involve heating the whole device to high temperatures, preventing the use of temperature-sensitive materials wi...

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  • ICALEO 2009 Paper #M403 (High-Efficiency and High Quality Welding of Aluminum Alloy by Hybrid System Combined Nd:YAG Laser and Diode Laser)

    High-Efficiency and High Quality Welding of Aluminum Alloy by Hybrid System Combined Nd:YAG Laser and Diode Laser
    Authors:
    Tomokazu Sakagawa, Kataoka Corporation; Yokohama-City Kanagawa Japan
    Shin-Ichi Nakashiba, Kataoka Corporation; Yokohama, Kanagawa Japan
    Shin Haraguchi, Okayama University; Okayama Japan
    Yasuhiro Okamoto, Okayama University; Okayama Japan
    Yoshiyuki Uno, Okayama University; Okayama Japan
    Presented at ICALEO 2009

    Recently, the welding of aluminum alloy has been strongly required for lightening the electronic products, automobiles and so on. Then hybrid laser system was newly developed in order to perform the high efficiency ...

    $28.00

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