PICALO 2008 Paper #903 (Reliable High-Power Laser Diode Arrays)

Reliable High-Power Laser Diode Arrays
Authors:
Brad Debok, Northrop Grumman Cutting Edge Optronics; St. Charles MO USA
Ed Stephens, Northrop Grumman Cutting Edge Optronics; St. Charles MO USA
Jeremy Junghans, Northrop Grumman Cutting Edge Optronics; St. Charles MO USA
Ryan Feeler, Northrop Grumman Cutting Edge Optronics; St. Charles MO USA
Presented at PICALO 2008

Northrop Grumman / Cutting Edge Optronics has developed a line of microchannel-cooled laser diode arrays in which the coolant is electrically isolated from the current path. As a result, these arrays do not require the use of deionized water. The thermal performance of these arrays is presented and, in one case, shown to far exceed the performance of standard copper microchannel-cooled packages. This sets them apart from other non-DI microchannel coolers currently on the market which typically have worse thermal performance than copper MCCs. These newly-developed coolers are compatible with other technologies developed by NGCEO that enable long lifetimes under harsh operating conditions. In particular, these arrays can be assembled using hard-solder technology that enables power-cycled and high-current operation. The soldering technology also generates arrays that are easily lensed and satisfy a wide range of direct diode needs, including welding, marking, and complex line generation applications. These microchannel-cooled arrays represent an important next step in the solid state laser industry. They allow for much simpler (non-deionized) cooling systems while maintaining excellent thermal performance and lifetime.

PICALO 2008 Paper #904 (New Developments in Co2 Laser Technology Enable New Applications)

New Developments in Co2 Laser Technology Enable New Applications
Authors:
Frank Gaebler, Coherent Inc; Bloomfield CT USA
Presented at PICALO 2008

Sealed off CO2 lasers are proven in industry for high volume manufacturing applications such as cutting and drilling, processing of glass and ceramics, and flexography. Cutting of thin metal, plastic or organic materials like leather, wood, paper textiles has become an established application in the market. Cutting of glass and PCB materials is only now becoming mature. Laser users vary from job shop and automotive to semiconductor manufacturing; from dusty and oily manufacturing floors to clean room environments. In comparison to High Power CO2 lase...

PICALO 2008 Paper #905 (Does High Beam Quality of Solid State Lasers Enhance Laser Material Processing? (Invited Paper))

Does High Beam Quality of Solid State Lasers Enhance Laser Material Processing? (Invited Paper)
Authors:
Mohammed Naeem, GSI Group, Inc.; Rugby Great Britain
John Chinn, GSI Group Inc.; Novi MI USA
Bo Gu, GSI Group Inc.; Wilmington MA USA
Presented at PICALO 2008

Lasers have been in use for material processing for decades as a flexible tool for different processes i.e. welding, cutting, drilling, surface modifications etc. Laser material processing offers a number of advantages over other processing technologies, i.e. high processing speeds, low heat input (minimal disruption to the parent material and coatings), low distortion of the parts, better cosmetic appearanc...

PICALO 2008 Paper #906 (Process Control on Laser Cladding by Coaxial Vision for Direct Manufacturing of 3D Metallic Structures)

Process Control on Laser Cladding by Coaxial Vision for Direct Manufacturing of 3D Metallic Structures
Authors:
Mehdi Guiraud, Gip Gerailp; Arcueil France
Pascal Aubry, Gip Gerailp; Arcueil France
Thierry Malot, Gerailp; Cedex France
Kevin Verdier, Gerailp; Cedex France
Presented at PICALO 2008

This article presents investigations carried out on the generation of metallic 3D structures. In order to generate 3D complex structures in laser cladding, it is important to control the deposition process. In this article, we present our new results on the process control design and implementation for direct manufactu...

PICALO 2008 Paper #907 (Advances in Laser-Deposition Equipment and Capabilities)

Advances in Laser-Deposition Equipment and Capabilities
Authors:
Richard Grylls, Optomec; Albuquerque NM USA
James Bullen, Optomec; Albuquerque NM USA
David Keicher, Optomec; Albuquerque NM USA
Presented at PICALO 2008

Laser Deposition techniques are gaining wider acceptance within manufacturing industries for both repair and rapid manufacture of metal components. The Laser Engineered Net Shaping (LENS®) process is one of the leading techniques in this field. Multiple LENS systems are now employed at DoD and other facilities, repairing a variety of high-performance components. In this role, LENS can be employed to shorten overhaul cycle times, and in some cases ex...

PICALO 2008 Paper #908 (Process Control in Laser Materials Processing - Combined Sensor Technologies for Secure Quality Assurance)

Process Control in Laser Materials Processing - Combined Sensor Technologies for Secure Quality Assurance
Authors:
Markus Kogel-Hollacher, Precitec Optronik GmbH; Rodgau Germany
Jgen Mler-Borhanian, Precitec Kg; Gaggenau Germany
Christoph Dietz, Precitec Optronik Gmhb; Rodgau Germany
Thomas Nicolay, Precitec Optronik Gmhb; Rodgau Germany
Axel Kattwinkel, Precitec Optronik Gmhb; Rodgau Germany
Martin Halschka, Precitec Vision Gmhb & Co; Neftenbach Germany
Presented at PICALO 2008

The use of photo-diode sensors to in-line monitor a laser welding process is well known and state of the art. In the latter past the first camera ba...

PICALO 2008 Paper #M1001 (Manufacturing of Shaped Holes in Multi-Layer Plates by Laser Drilling)

Manufacturing of Shaped Holes in Multi-Layer Plates by Laser Drilling
Authors:
Kurt Walther, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Jens Dietrich, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Martin Hermans, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Martin Witty, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Mihael Brajdic, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Alexander Horn, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Ingomar Kelbassa, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Reinhart Poprawe, Lehrstuhl fuer Lasertechnik, RWTH; Aachen Germany
Presented at PI...

PICALO 2008 Paper #M1002 (Practical Issues in Laser Micro/Nano Machining)

Practical Issues in Laser Micro/Nano Machining
Authors:
Wenwu Zhang, GE Global Research; Schenectady NY USA
Jeffrey Shaw, GE Global Research; Schenectady NY USA
Brian Farrell, GE Global Research; Schenectady NY USA
Presented at PICALO 2008

Laser has become an important tool for micro/nano machining. To enable the successful application of laser micro/nano machining in manufacturing, requirements on geometry, speed and quality have to be fulfilled. In this paper, we review several representative applications of laser micro/nano machining, and discuss ways of solving the practical issues simultaneously.

PICALO 2008 Paper #M1003 (Laser-assisted Hot Embossing of Microstructures)

Laser-assisted Hot Embossing of Microstructures
Authors:
Jens Holtkamp, Fraunhofer Institute for Laser Technology; Aachen Germany
Arnold Gillner, Fraunhofer Institute for Laser Technology; Aachen Germany
Presented at PICALO 2008

Conventional technologies for the manufacturing of micro-structured components with geometries below 100µm are injection moulding and hot embossing. Both technologies are mainly limited to polymer materials and require long cycle times since the whole forming tool has to be heated. These drawbacks can be eliminated by a newly developed laser assisted hot embossing technology, where high energy density laser radiation is used for a selective and fast heatin...

PICALO 2008 Paper #M101 (Fundamental Issues Concerning Material Removal by Laser Irradiation of Insulating Materials (Invited Paper))

Fundamental Issues Concerning Material Removal by Laser Irradiation of Insulating Materials (Invited Paper)
Authors:
Tom Dickinson, Washington State University; Pullman WA USA
Presented at PICALO 2008

Laser materials interactions underlie a multitude of applications ranging from surface modification and structure formation, machining and cutting, and the formation of atom/molecule/ion sources for thin film growth (pulsed laser deposition). For several years we have been investigating the laser-induced emission mechanisms from materials at fluences below the threshold for optical breakdown in transparent wide bandgap materials. Under these conditions, very gentle, single atomic layer manipulat...