Product Code: ICA11_M401

Ultrafast Laser with High Energy and High Average Power for Industrial Micromachining: Comparison Ps-Fs
Authors:
John Lopez, Alphanov, University of Bordeaux; Talence Cedex France
Anne Lidolff, Alphanov; Talence France
Martin Delaigue, Amplitude Systemes; Pessac France
Clemens Hönninger, Amplitude Systemes; Pessac France
Sandrine Ricaud, Amplitude Systemes; Pessac France
Eric Mottay, Amplitude Systemes; Pessac France
Presented at ICALEO 2011

Pico and femtosecond lasers present a growing interest for surface structuring or thin film selective ablation applications such as flat panel display, photovoltaic or OLED industries. Indeed, they combine the unique capacity to process any type of material (dielectrics, semiconductors, metals) with an outstanding precision and a reduced affected zone. We report on results about surface engraving of metals (Al, Cu, Mo, Ni), semiconductor (Si) and polymer (PC) using a picosecond thin disk Yb:YAG-amplifier. The pulse duration of this source can be changed using two different configurations: direct amplification of a 34ps-oscillator on one hand, and 1ps-chirped pulse amplification (CPA) scheme on the other hand. We compare these results to recently obtained achievements using femtosecond lasers based on Yb-doped crystals and fibers, respectively, and operating at comparable output power levels, up to 15Watt.