Product Code: ICA11_M1001

CO2 Laser Cutting of Flexible Glass Substrates
Authors:
Xinghua Li, Science and Technology, Corning Incorporated; Corning NY USA
Sean M. Garner, Science and Technology, Corning Incorporated; Corning NY USA
Presented at ICALEO 2011

We investigated the effects of cutting flexible glass substrates approximately 100 µm thick, using a CO2 laser full-body cutting technique. The technique uses a CO2 laser heating and water-jet quenching process to generate a tensile stress, which propagated a full-body crack along the cutting line. We examined the effects of process parameter variations on the cutting speed and glass edge quality. These parameters included laser conditions, water-jet cooling flow, water-jet distance to the laser beam, and thermal contacts to the carrier platen. We will further present the edge strength of the specimens cut with the approach at optimal cutting conditions.