Product Code: ICAL07_M1302

A Selective Direct Patterning Process of Multilayer using Deep UV Laser
Authors:
D.Y. Kim, LG Electronics ; Kyungki-Do South Korea
JoongYong An, LG Electronics PERI; Pyeongtaek-si, Gyeonggi-do South Korea
Y.M. Jeong, LG Electronics ; Kyungki-Do South Korea
J.W. Kim, LG Electronics ; Kyungki-Do South Korea
K.Y. Baek, LG Electronics ; Kyungki-Do South Korea
H.S. Kang, LG Electronics ; Kyungki-Do South Korea
S.K. Hong, LG Electronics ; Kyungki-Do South Korea
Presented at ICALEO 2007

A traditional pattern making processes by exposure process require PR coating, exposure, develop, etching and PR strip. This causes high equipment cost, running cost and environment pollution. A laser selective direct patterning can be the good substitute for those typical processes to overcome the above problems. The patterns on a small mask are projected onto a substrate by the homogenized beam of deep UV laser. This process ablates only the selected layers clearly by the required depth. In this paper, the experimental investigations are discussed for obtaining the optimal process condition to ablate selectively the multiple layers.

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