PICALO 2008 Paper #M1203 (Fabrication of Carbon Nanotube Interconnections by Current-assisted Laser Irradiation)
Fabrication of Carbon Nanotube Interconnections by Current-assisted Laser Irradiation
Authors:
Tao Gong, Tsinghua University, Dept of Mechanical Engineering; Beijing Peoples Republic of China
Yong Zhang, Tsinghua University, Dept of Mechanical Engineering; Beijing Peoples Republic of China
Chaofeng Wu, Tsinghua University; Beijing Peoples Republic of China
Minlin Zhong, Tsinghua University; Beijing Peoples Republic of China
Wenjin Liu, Tsinghua University, Dept of Mechanical Engineering; Beijing Peoples Republic of China
Jinquan Wei, Tsinghua University; Beijing Peoples Republic of China
Yi Jia, Tsinghua University; Beijing Peoples Re...$28.00
PICALO 2008 Paper #M1204 (Improving Optical Transmittance of Double Walled Carbon Nanotube Film by Laser Processing)
Improving Optical Transmittance of Double Walled Carbon Nanotube Film by Laser Processing
Authors:
Tao Gong, Tsinghua University, Dept of Mechanical Engineering; Beijing Peoples Republic of China
Yong Zhang, Tsinghua University, Dept of Mechanical Engineering; Beijing Peoples Republic of China
Minlin Zhong, Tsinghua University; Beijing Peoples Republic of China
Wenjin Liu, Tsinghua University, Dept of Mechanical Engineering; Beijing Peoples Republic of China
Yi Jia, Tsinghua University; Beijing Peoples Republic of China
Chaofeng Wu, Tsinghua University; Beijing Peoples Republic of China
Kunlin Wang, Tsinghua University; Beijing Peoples...$28.00
PICALO 2008 Paper #M1205 (Fabrication of Micro-Machine Elements by Five-Axis Laser Processing System)
Fabrication of Micro-Machine Elements by Five-Axis Laser Processing System
Authors:
Souta Matsusaka, Chiba University; Chiba Japan
Kensuke Iijima, Chiba University; Chiba Japan
Takehiro Watanabe, Chiba University; Chiba USA
Youhei Mizoguchi, Chiba University ; Chiba Japan
Presented at PICALO 2008
Laser micro-processing system, which consisted of five-axis automatic stage controlled with PC and UV nanosecond laser oscillator was developed. This system enabled both of milling and lathe processing by arrangement of the stages. Micro-windmills with multiple blades, micro-cylindrical cantilevers, micro-screw and micro-bevel gear were fabricated on polyimide fi...$28.00
PICALO 2008 Paper #M205 (Large Area Nanopatterning of Silicon Surface by Chemical Assisted Laser Processing using Near-Field Enhancement by Particle-Lens Arrays)
Large Area Nanopatterning of Silicon Surface by Chemical Assisted Laser Processing using Near-Field Enhancement by Particle-Lens Arrays
Authors:
Wei Guo, 1Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering; Manchester Great Britain
ZENGBO WANG, Laser Processing Research Centre; Manchester Great Britain
Lukyanchuk Boris, Data Storage Institute, Dsi Building, 5 Engineering Drive 1, Singapore; Singapore Singapore
David Whitehead, 1Laser Processing Research Centre, School of Mechanical, Aerospace and Civil Engineering; Manchester Great Britain
Lin Li, 1Laser Processing Research Centre, School of Mechanical, Aerospace and Civil E...$28.00
PICALO 2008 Paper #M301 (Progress in R&D on Ultrafast Laser Processing and Prospect of Industrial Applications (Invited Paper))
Progress in R&D on Ultrafast Laser Processing and Prospect of Industrial Applications (Invited Paper)
Authors:
Xinbing Liu, Panasonic Boston Laboratory; Cambridge MA USA
Presented at PICALO 2008
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PICALO 2008 Paper #M302 (Innovative Laser Technology for Semiconductor Manufacturing -Stealth Dicing (Invited Paper))
Innovative Laser Technology for Semiconductor Manufacturing -Stealth Dicing (Invited Paper)
Authors:
Etsuji Ohmura, Osaka University; Suita, Osaka Japan
Hideki Morita, Hamamatsu Photonics K.K.; Iwata Japan
Masayoshi Kumagai, Hamamatsu Photonics K.K.; Iwata Japan
Presented at PICALO 2008
When a permeable nanosecond pulse laser which is focused into the inside of a silicon wafer is scanned in the horizontal direction, a belt-shaped high dislocation density layer including partially polycrystalline region is formed at an arbitrary depth in the wafer. Applying tensile stress perpendicularly to this belt-shaped modified-layer, silicon wafer can be separated easily into ind...$28.00
PICALO 2008 Paper #M303 (High Quality Micro Machining with Tailored Short and Ultra Short Laser Pulses)
High Quality Micro Machining with Tailored Short and Ultra Short Laser Pulses
Authors:
Arnold Gillner, Fraunhofer-Institute for Laser Technology; Aachen Germany
Claudia Hartmann, Fraunhofer-Institute for Laser Technology; Aachen Germany
Andreas Dohrn, Fraunhofer-Institute for Laser Technology; Aachen Germany
Presented at PICALO 2008
In the production of micro-scaled products and products with micro and nano scaled surface functionalities, laser ablation becomes a more and more important tool which is able to generate structure sizes in the range of 10 100 µm and with new machining strategies even in range smaller than one micrometer. One crucial task for all laser...$28.00
PICALO 2008 Paper #M305 (Precise Photonic Engines for Uv Pulsed Laser Deposition)
Precise Photonic Engines for Uv Pulsed Laser Deposition
Authors:
Ralph Delmdahl, Coherent GmbH; Goettingen Germany
Presented at PICALO 2008
High pulse energy excimer lasers with pulse energies between 300mJ and 1200mJ/pulse and photon energies between 5eV and 7.9eV lend maximum flexibility to the technique of pulsed laser deposition. On account of the high energy densities accessible with the latest generation of excimer lasers, the entire material spectrum including high band-gap metal oxides such as ZnO is amenable to precise and controlled ablation with subsequent stoichiometric transfer to the substrat. Because the transferred material needs time to smoothly deposit and position itself opti...$28.00
PICALO 2008 Paper #M401 (3D Microstructuring of Glass by Femtosecond Laser for Lab-On-A-Chip Applications (Invited Paper))
3D Microstructuring of Glass by Femtosecond Laser for Lab-On-A-Chip Applications (Invited Paper)
Authors:
Koji Sugioka, RIKEN; Saitama Japan
Yasutaka Hanada, RIKEN; Wako, Saitama Japan
Katsumi Nidorikawa, Riken; Wako, Saitama Japan
Presented at PICALO 2008
Three-dimensional (3D) microfabrication of photostructurable glass by femtosecond (fs) laser direct writing is demonstrated for manufacture of Lab-on-a chip devices. The fs laser direct writing followed by annealing and successive wet etching can fabricate the hollow microstructures, achieving a vareiety of microfluidic components and microoptical components in a glass chip. One of the interesting and important appl...$28.00
PICALO 2008 Paper #M402 (Development of Electrodes for the Application of Microbatteries (Invited Paper))
Development of Electrodes for the Application of Microbatteries (Invited Paper)
Authors:
Hui Xia, Nus; Singapore Singapore
Lu Li, National University of Singapore; Singapore
Presented at PICALO 2008
Miniaturization of electronic devices such as laboratory-on-chip or system-on-ship requires small power supply unit such as in micrometer size. Therefore all-solid-state microbatteries become important in those applications. This paper reports the studies and developments of thin film electrodes in the thickness of a few micrometers which were fabricated by a pulsed laser deposition technique. It has been demonstrated that the thin film electrodes not only have high power capacity but...$28.00