Product Code: PIC2008_P214

An Investigation of Cutting Polycrystalline Diamond using 355Nm Uv Pulse Laser
Authors:
Zhai Libin, National Center of Laser Technology, China; Beijing Peoples Republic of China
Chen Jimin, National Center of Laser Technology, Beijing University of Technology; Beijing Peoples Republic of China
Jiang Maohua, National Center of Laser Technology, China; Beijing Peoples Republic of China
Zhao Hongliang, National Center of Laser Technology, Beijing University of Technology; Beijing Peoples Republic of China
Sun Chunyu, Beijing Beidou Diamond Company; Beijing Peoples Republic of China
Presented at PICALO 2008

Polycrystalline diamond (PCD) is extensively used as cutting tool in machining hard-to-machine materials for its excellence performance such as hardness, toughness and wear resistance. It is, however cannot or hard to be machined by traditional techniques. As laser material removal is an effective processing technique for hard materials a frequency tripled Nd:YAG laser (λ=355nmPmax=10W, FWHM=15ns, M2<1.2) were employed to machine the PCD in this paper. The physical mechanisms of laser-matter machining and the influence of different laser parameters on the laser cutting of PCD were discussed and 50μm and 100um thickness PCD films were obtained by laser cutting. The breakdown threshold was also measured with the nanosecond laser. After cutting, optical microscope, scanning electron microscopy, X-ray diffraction, Micro-Raman spectroscopy and 3D surface measure instrument were used to analyzed the microstructure, particle-size, different elements transformation and the roughness of the cutting surface.
*This work is supported by Chinese Nature and Science Foundation under the grant of No.50575005.