Product Code: PIC2008_M604
Direct Fabrication of Micro Temperature Sensor Arrays by Laser Micro-Cladding Functional Materials on Ceramic Substrates
Cai Zhixiang, Wuhan National Laboratory for Optoelectronics; Wuhan Peoples Republic of China
Li Xiangyou, Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology; Wuhan Peoples Republic of China
Zeng Xiaoyan, Wuhan National Laboratory for Optoelectronics; Wuhan Peoples Republic of China
Hu Qianwu, Huazhong University of Science and Technology ; Wuhan Peoples Republic of China
Presented at PICALO 2008
In this report, laser micro-cladding technology has been used to fabricate the micro temperature sensor arrays on ceramic substrate directly. The fabricated temperature sensor arrays are composed of 44 thick-film thermal sensor (i.e. thermistors) arrays and Ag-Pd conductor layers. The thermistors, deposited on the substrate through a micro-pen, are composed of the thermal sensitive material. The Ag-Pd conductor layers, deposited on the substrate through coat-spinning apparatus, are used as the connective pad to connect the sensors to the monitor. The experimental results demonstrate that with optimal laser processing parameters, the relationship of the thermistor resistance versus temperature between 25oC and 95oC is linear with the temperature coefficient of resistance 2273 ppm/oC. This technique has the advantages without using mask and with simple processing techniques. It can be applied as the thermal sensors for fast temperature measurement of the material surface as well as the small gap temperature measurement in biological engineering. These results demonstrate that laser micro-cladding technology has the ability to fabricate multifunctional, multi-material integrated components in an agile and flexible way.
This project is financially supported with the 863 High Tech Program with the number 2006AA04Z313
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