Product Code: PIC2008_M403

Nd:Yag Laser and Micropen Integrated Fabrication of Mim Thick Film Capacitors
Xiaoyan Zeng, Hust; Wuhan Peoples Republic of China
Yu Cao, HUST; Wuhan Peoples Republic of China
Xiangyou Li, Huazhong University of Science and Technology ; Wuhan Peoples Republic of China
Presented at PICALO 2008

With rapid development of the electronic industry, how to respond the market requests quickly, shorten R&D prototyping fabrication period, and reduce the cost of the electronic devices have become a challenge work, which need flexible manufacturing methods. In this work, two direct-write processing methods, direct material deposition by micropen and Nd:YAG laser micro cladding, are integrated with CAD/CAM technology for the hybrid fabrication of passive electronic components (LMCEP). Especially, the Metal-Insulator-Metal (MIM) type thick film capacitors are fabricated on ceramic substrates by this method. A basic two-step procedure of the LMCEP process for the thick film pattern preparation is presented. Multilayer structure and properties are demonstrated and discussed. Result of the frequency characteristics test shows the MIM thick film capacitors fabricated by the LMCEP process have good DC voltage stability, good frequency stability and low dissipation factor.

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