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Product Code: PIC2008_106

High Precision Machining and Cutting of Si using a Single Mode (Invited Paper)
Authors:
William O'Neill, University of Cambridge; Cambridge Great Britain
K. Li, University of Cambridge; Cambridge Great Britain
Tony Hoult, Spi Lasers Inc; Santa Clara CA USA
Presented at PICALO 2008

The application of lasers in the microelectronics sector has grown steadily over the past 10 years as DPSS lasers have increased power output and high levels of reliability. The readiness of such systems to operate at various output wavelengths such as 355nm has further enabled a greater range of processing operations for Si based microsystems. Recent advances in Yb doped fiber lasers with a MOPA configuration have provided far greater control of the laser material interaction than is possible with DPSS systems driven at high repetition rates using Pockel cells and Q-switching. This paper presents recent findings of new Si machining and cutting capabilities that can be achieved using modulation controlled Yb doped fiber lasers and compares these with DPSS lasers operating at 355nm.

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