Product Code: ICA12_M1202
Dual Beam Laser Grooving of CFRP by Pulsed Lasers - Invited Presentation - 40 Minutes
Masayuki Fujita, Institute for Laser Technology, Institute of Laser Engineering, Osaka Univ.; Osaka Japan
Toshihiro Somekawa, Institute for Laser Technology, Osaka Univ.; Suita Japan
Takumi Ozaki, Department of Electrical Engineering, Kinki Univ.; Higashiosaka Japan
Minoru Yoshida, Department of Electrical Engineering, Kinki Univ.; Higashiosaka Japan
Noriaki Miyanaga, Institute of Laser Engineering, Osaka Univ.; Suita Japan
Presented at ICALEO 2012
We have been investigating micromachining of CFRP by ultra-short laser pulses in order to minimize material damages and HAZ. The laser system used in this study was a Ti:Sapphire laser with pulsewidth of 100fs. For comparison, we also used 200ps stretched pulses from the Ti:Sapphire laser and output from a 200ns-pulsed fiber laser. In order to overcome slow processing speed by ultra-short pulses, we have proposed a novel dual beam grooving. In the first process, small-energy ultra-short pulses are used to cut the edges of the groove with multiple scanning. Secondly, high-energy long-pulses ablate the remained part for high-speed with a single scanning. We used 2mm-thick uni-directional CFRP samples. Trenches with depth of 100 μm and width of 50μm were machined by 200ps laser pulses. Then, 200ns fiber laser pulses were focused on one of the remained part in a single scanning. As a result, a groove with depth of 100 μm and width of 150μm was formed without significant HAZ.
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