Product Code: ICA10_M703

Multi-Wavelength Micromachining of Silicon and Glass by Q-Switched Short Pulsed Lasers
Authors:
Shiva Gadag, Center for Laser Aided Manufacturing, Southern Methodist University; Dallas TX USA
Radovan Kovacevic, Center for Laser Aided Manufacturing, Southern Methodist University; Dallas TX USA
Presented at ICALEO 2010

Laser Micromachining of semiconductor materials - Silicon wafers, glass and quartz are experimentally investigated using the Spectra Physics diode pumped solid state laser. The Q-switched Nd:YVO4 DPSS laser of fundamental wavelength 1064 nm with high pulsing frequencies (15 300 kHz) and short pulse duration (10 ns) is used for micromachining. Laser drilling of array of holes, machining of micro-channels, micro-milling, cutting and dicing of wafers and micro texturing are performed with frequency doubled, tripled and quadrupled harmonic generators. High resolution optical microscope and optical profiler are used to characterize the microstructures of various features formed. Laser threshold fluence for ablation of silicon are numerically determined.