Product Code: ICA10_M204

Choice of Laser Sources for Micromachining Applications
Authors:
Mohammed Naeem, JK Lasers; Rugby Great Britain
Presented at ICALEO 2010

The increasing complexity of microelectronics/ engineering devices and the requirement for higher yields and automated production systems place stringent demands on the assembly techniques and performance requirements of materials, machining and joining techniques. This has led to increasing interest in the use of low power lasers for cutting, drilling, welding, soldering and marking of small assemblies. Of particular interest to micro-component industries is the ability of such lasers to apply controlled amounts of energy in precise areas, utilizing extremely low heat input, resulting in very low distortion, and coupled with the ability to operate at high production rates in a flexible manner.