Product Code: ICA10_1401

The Effect of Deposition Pattern on Thermal Stress and Deformation in Laser Solid Forming
Authors:
Xin Lin, State Key Laboratory of Solidification Processing, Northwestern Polytechnical University; Xi'an Peoples Republic of China
Bo Wang, State Key Laboratory of Solidification Processing, Northwestern Polytechnical University; Xi\'An Peoples Republic of China
Jun YU, State Key Laboratory of Solidification Processing, Northwestern Polytechnical University; Xi'an
Liang Ma, State Key Laboratory of Solidification Processing, Northwestern Polytechnical University; Xi\'An Peoples Republic of China
Jing Chen, State Key Laboratory of Solidification Processing, Northwestern Polytechnical University; Xi\'An Peoples Republic of China
Weidong Huang, State Key Laboratory of Solidification Processing, Northwestern Polytechnical University; Xi\'An Peoples Republic of China
Presented at ICALEO 2010

A transient 3-D temperature/stress indirect-coupled field finite-element model was developed for simulate Laser Solid Forming (LSF) process. The effect of the deposition pattern (e.g. raster, outside-in spiral and Hilbert fractal pattern) on the thermal field, thermal stresses and deformation induced during the LSF process was examined. The result shows that the transient temperature gradient and the maximum equivalent stress in the LSFing part decreased gradually in LSF process. The transient temperature gradient and the maximum equivalent stress were the smallest using Hilbert fractal deposition pattern on comparison with the other patterns. On the comparative analysis of the residual tensile stress distribution at the interface between the substrate and deposit and the substrate deformation using three deposition pattern, it is found that the larger residual stress and the smallest substrate deformation is produced using the raster deposition pattern, and the smaller residual stress stress and the largest substrate deformation is produced using Hilbert fractal deposition pattern.