Product Code: ICAL06_M1006

Femtosecond Laser Machining of Dielectric Materials for Biomedical Applications
Authors:
Burr Zimmerman, The Ohio State University; Columbus OH USA
Hae Woon Choi, The Ohio State University; Columbus OH USA
Jeremy Steach, The Ohio State University; Columbus OH USA
Dave F Farson, The Ohio State University; Columbus OH USA
L James Lee, The Ohio State University; Columbus OH USA
Susan V Olesik, The Ohio State University; Columbus OH USA
Presented at ICALEO 2006

Femtosecond laser ablation of borosilicate glass and fused silica for fabrication of microfluidic channels for biomedical device applications is studied. Channel widths ranging from 0.5um to 50um were fabricated for the specific applications and ablation thresholds were measured for both fundamental (775 nm) and frequency doubled laser radiation. The affect of laser energy, spot size and spot pitch on surface roughness was determined. It was found the at low fluences and pitch, surfaces acceptable for some applications could be machined. However, in some cases, smoother channels were desired. Hydro-gel coatings were demonstrated to the decrease roughness of fused silica channel walls.