Product Code: ICAL06_410_2

Multifunctional Hand-held Laser Processing Device
Authors:
Andreas Ostendorf, Laser Zentrum Hannover e.V.; Hannover Germany
Christian Hennigs, Laser Zentrum Hannover e.V.; Hannover AL Germany
Oliver Meier, Laser Zentrum Hannover e.V.; Hannover Germany
Heinz Haferkamp, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2006

For the economical dismantling of nuclear installations, modular cutting systems are necessary to enable a low-emission cutting process particularly for high sheet thicknesses. Hand-held laser processing devices offer this possibility with a flexible implementation. In this paper, a new developed hand-held laser processing device will be presented, which applies a novel bifocal optic, a special cutting system with two gas laval nozzles and makes a multifunctional application area available. Laser notching, cutting, material removal and prenotching in combination with laser cutting are already possible with this system. Extended modules for surface treatments and welding applications are under development. Besides its many fields of application, the processing device HLG 3000-sk-df offers additionally wide adaptation possibilities in a very light (3.5 kg) and compact design. This can be realised with the special mirror geometry, which combines a beam deflection mirror and a focusing lens. For the first time, the novel bifocal optic enables the laser prenotching and cutting in one cycle by using a hand-held laser processing device. The double focus configuration of the laser beam results from the splitted mirror design. The cutting system based on two gas laval nozzles constitutes a high potential for laser cutting applications resulting in high cutting qualities also for high sheet thicknesses and avoiding burr adhesion.