Product Code: ICAL05_M202

UV-Micromachining by Excimer Laser
Authors:
Rainer Paetzel, Lambda Physik AG; Goettingen Germany
Presented at ICALEO 2005

With the trend to ever smaller feature the use UV-wavelength for micromachining and microstructuring applications in microelectronics- and semiconductor industry is steadily increasing. The use of excimer laser in combination with optimized UV-beam delivery systems presents the direct path to micromachining with highest resolution. Recent advances in excimer laser technology have greatly reduced the maintenance effort by extension of the gas lifetime and laser tube lifetime. With these new performance levels of advanced excimer laser and highly efficient UV-beam delivery systems, the excimer laser presents the cost effective solution for various applications in this industries. In this paper an update on excimer laser technology, laser performance and the cost effective application in microelectronics and semiconductor industry is given.