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  • PICALO 2008 Paper #M504 (Parameter Studies of Fibre Laser Micro-Welding of Aisi 316L using Taguchi Method)

    Parameter Studies of Fibre Laser Micro-Welding of Aisi 316L using Taguchi Method
    Authors:
    Chan Chi Wai, AMT Research Center, Dept. of ISE, the HKPolyU; Hong Kong
    H.C. Man, AMT Research Center, Dept. of ISE, the HKPolyU; Hong Kong
    T.M. Yue, AMT Research Center, Dept. of ISE, the HKPolyU; Hong Kong
    Presented at PICALO 2008

    This paper discusses the application of the Taguchi experimental design approach in optimizing the key process parameters for micro-welding of thin AISI 316L foil using the 100W CW fibre laser. A L16 Taguchi experiment was conducted to systematically understand how the power, scanning velocity, focus position, gas flow rate and type of shielding ...

    $28.00

  • PICALO 2008 Paper #M503 (Development and Application of Miniaturized Scanners for Laser Beam Micro Welding)

    Development and Application of Miniaturized Scanners for Laser Beam Micro Welding
    Authors:
    Andrei Boglea, Fraunhofer Institute for Laser Technology; Aachen Germany
    Felix Schmitt, Fraunhofer Institute for Laser Technology; Aachen Germany
    Max Funck, Fraunhofer Institute for Laser Technology; Aachen Germany
    Reinhart Poprawe, Fraunhofer Institute for Laser Technology; Aachen Germany
    Presented at PICALO 2008

    Nowadays, flexible production systems for the laser joining of micro parts require a higher dynamic and precision, as well as a higher flexibility concerning the working space. The combination of miniaturized scanner-based laser joining systems and high-pe...

    $28.00

  • PICALO 2008 Paper #M502 (Microwelding Performance Comparison Between a Low Power (125W) Pulsed Nd:Yag Laser and a Low Power (200W) Single Mode Fiber Laser)

    Microwelding Performance Comparison Between a Low Power (125W) Pulsed Nd:Yag Laser and a Low Power (200W) Single Mode Fiber Laser
    Authors:
    Mohammed Naeem, GSI Group, Inc. - Laser Division; Rugby Great Britain
    Steffan Lewis, Gsi Group; Rugby Great Britain
    John Crinn, Gsi Group; Rugby Great Britain
    Presented at PICALO 2008

    The increasing complexity of microelectronics/ engineering devices and the requirement for higher yields and automated production systems place stringent demands on the assembly techniques and performance requirements of materials and joining techniques. This has led to increasing interest in the use of low power lasers for microwelding of small assem...

    $28.00

  • PICALO 2008 Paper #M404 (Experimental Micromachining Results using a Uv Laser with the Laser Microjet®)

    Experimental Micromachining Results using a Uv Laser with the Laser Microjet�
    Authors:
    Alexandre Pauchard, Synova Sa; Ecublens Switzerland
    Nandor Vago, Synova Sa; Ecublens Switzerland
    Nicolas Godde, Synova SA; Ecublens Switzerland
    Bernold Richerzhagen, Synova Sa; Ecublens Switzerland
    Presented at PICALO 2008

    UV wavelengths are interesting for photothermal cutting of materials that have a low absorption coefficient or are transparent at 1064 and 532 nm wavelengths, such as copper, sapphire or glass. The high photon energy of UV lasers plays also a significant role in photochemical machining of polymer materials such as polyimide. In addition to the absorp...

    $28.00

  • PICALO 2008 Paper #M403 (Nd:Yag Laser and Micropen Integrated Fabrication of Mim Thick Film Capacitors)

    Nd:Yag Laser and Micropen Integrated Fabrication of Mim Thick Film Capacitors
    Authors:
    Xiaoyan Zeng, Hust; Wuhan Peoples Republic of China
    Yu Cao, HUST; Wuhan Peoples Republic of China
    Xiangyou Li, Huazhong University of Science and Technology ; Wuhan Peoples Republic of China
    Presented at PICALO 2008

    With rapid development of the electronic industry, how to respond the market requests quickly, shorten R&D prototyping fabrication period, and reduce the cost of the electronic devices have become a challenge work, which need flexible manufacturing methods. In this work, two direct-write processing methods, direct material deposition by micropen and Nd:YAG laser micro cla...

    $28.00

  • PICALO 2008 Paper #M402 (Development of Electrodes for the Application of Microbatteries (Invited Paper))

    Development of Electrodes for the Application of Microbatteries (Invited Paper)
    Authors:
    Hui Xia, Nus; Singapore Singapore
    Lu Li, National University of Singapore; Singapore
    Presented at PICALO 2008

    Miniaturization of electronic devices such as laboratory-on-chip or system-on-ship requires small power supply unit such as in micrometer size. Therefore all-solid-state microbatteries become important in those applications. This paper reports the studies and developments of thin film electrodes in the thickness of a few micrometers which were fabricated by a pulsed laser deposition technique. It has been demonstrated that the thin film electrodes not only have high power capacity but...

    $28.00

  • PICALO 2008 Paper #M401 (3D Microstructuring of Glass by Femtosecond Laser for Lab-On-A-Chip Applications (Invited Paper))

    3D Microstructuring of Glass by Femtosecond Laser for Lab-On-A-Chip Applications (Invited Paper)
    Authors:
    Koji Sugioka, RIKEN; Saitama Japan
    Yasutaka Hanada, RIKEN; Wako, Saitama Japan
    Katsumi Nidorikawa, Riken; Wako, Saitama Japan
    Presented at PICALO 2008

    Three-dimensional (3D) microfabrication of photostructurable glass by femtosecond (fs) laser direct writing is demonstrated for manufacture of Lab-on-a chip devices. The fs laser direct writing followed by annealing and successive wet etching can fabricate the hollow microstructures, achieving a vareiety of microfluidic components and microoptical components in a glass chip. One of the interesting and important appl...

    $28.00

  • PICALO 2008 Paper #M305 (Precise Photonic Engines for Uv Pulsed Laser Deposition)

    Precise Photonic Engines for Uv Pulsed Laser Deposition
    Authors:
    Ralph Delmdahl, Coherent GmbH; Goettingen Germany
    Presented at PICALO 2008

    High pulse energy excimer lasers with pulse energies between 300mJ and 1200mJ/pulse and photon energies between 5eV and 7.9eV lend maximum flexibility to the technique of pulsed laser deposition. On account of the high energy densities accessible with the latest generation of excimer lasers, the entire material spectrum including high band-gap metal oxides such as ZnO is amenable to precise and controlled ablation with subsequent stoichiometric transfer to the substrat. Because the transferred material needs time to smoothly deposit and position itself opti...

    $28.00

  • PICALO 2008 Paper #M303 (High Quality Micro Machining with Tailored Short and Ultra Short Laser Pulses)

    High Quality Micro Machining with Tailored Short and Ultra Short Laser Pulses
    Authors:
    Arnold Gillner, Fraunhofer-Institute for Laser Technology; Aachen Germany
    Claudia Hartmann, Fraunhofer-Institute for Laser Technology; Aachen Germany
    Andreas Dohrn, Fraunhofer-Institute for Laser Technology; Aachen Germany
    Presented at PICALO 2008

    In the production of micro-scaled products and products with micro and nano scaled surface functionalities, laser ablation becomes a more and more important tool which is able to generate structure sizes in the range of 10 100 µm and with new machining strategies even in range smaller than one micrometer. One crucial task for all laser...

    $28.00

  • PICALO 2008 Paper #M302 (Innovative Laser Technology for Semiconductor Manufacturing -Stealth Dicing (Invited Paper))

    Innovative Laser Technology for Semiconductor Manufacturing -Stealth Dicing (Invited Paper)
    Authors:
    Etsuji Ohmura, Osaka University; Suita, Osaka Japan
    Hideki Morita, Hamamatsu Photonics K.K.; Iwata Japan
    Masayoshi Kumagai, Hamamatsu Photonics K.K.; Iwata Japan
    Presented at PICALO 2008

    When a permeable nanosecond pulse laser which is focused into the inside of a silicon wafer is scanned in the horizontal direction, a belt-shaped high dislocation density layer including partially polycrystalline region is formed at an arbitrary depth in the wafer. Applying tensile stress perpendicularly to this belt-shaped modified-layer, silicon wafer can be separated easily into ind...

    $28.00

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