• ICALEO 2013 Paper #M601 (Structuring and joining transparent materials with ultra short pulse lasers)

    Structuring and joining transparent materials with ultra short pulse lasers
    Authors:
    Sinisa Vukelic, -; -
    Panjawat Kongsuwan, -; -
    Y. Lawrence Yao, -; -
    Presented at ICALEO 2013

    Nonlinear absorption of femtosecond-laser pulses enables the induction of structural changes in the interior of bulk transparent materials without affecting their surface. Features are generated by focusing the femtosecond laser pulses in the interior of a single glass piece to investigate change in morphology, mechanical properties, and ring structures of the modified region. Detailed characterization of the effect of laser irradiation is accomplished using differential interference con...

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  • ICALEO 2013 Paper #M504 (Ultrafast Laser-Based Post-Processing of Parts Produced by Additive Manufacturing)

    Ultrafast Laser-Based Post-Processing of Parts Produced by Additive Manufacturing
    Authors:
    Ilya Mingareev, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Tobias Bonhoff, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Ashraf El-Sherif, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Tim Biermann, Joining Technologies Research Center; East Granby CT USA
    Wilhelm Meiners, Fraunhofer Ilt; Aachen Germany
    Ingomar Kelbassa, Fraunhofer Ilt; Aachen Germany
    Martin Richardson, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Presented at ICALEO 2013

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  • ICALEO 2013 Paper #M502 (Silicon Laser Micro-processing of New Energy Source Materials)

    Silicon Laser Micro-processing of New Energy Source Materials
    Authors:
    Jun Duan, Huazhong University of Science and Technology; Wuhan
    Huan Yang, Huazhong University of Science and Technology; Wuhan Peoples Republic of China
    Xiaoyan Zeng, Huazhong University of Science and Technology; Wuhan
    Leiming Deng, Huazhong University of Science and Technology; Wuhan
    Presented at ICALEO 2013

    In recent years, laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention. High power Diode Pumped Solid State (DPSS) lasers have been gained wider application in microelectronics, flat panel display, and solar cell m...

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  • ICALEO 2013 Paper #M407 (Expansion of Pulsed Laser Process Limits Through Pulsed Fiber Lasers)

    Expansion of Pulsed Laser Process Limits Through Pulsed Fiber Lasers
    Authors:
    Christoph Ruettimann, Rofin-Lasag Ag; Thun Switzerland
    Ulrich Duerr, Rofin-Lasag Ag; Thun Switzerland
    Noemie Dury, Rofin-Lasag Ag; Thun Switzerland
    Ronald Holtz, Class 4 Laser Professionals; Lyss Switzerland
    Presented at ICALEO 2013

    Pulsed Nd:YAG lasers are the state-of-the-art for a large number of micro-applications, and have provided remarkable performance in many applications including welding and drilling processes.
    Thanks to the combination of several key characteristics, such as high beam quality, fast pumping diodes, and high speed electronics, a new generation of pulsed...

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  • ICALEO 2013 Paper #M406 (New Micro and Nano Laser Machining Applications with a Versatile Ultrashort Pulse Laser System and Diffractive Optical Elements)

    New Micro and Nano Laser Machining Applications with a Versatile Ultrashort Pulse Laser System and Diffractive Optical Elements
    Authors:
    Erwin Steiger, Erwin Steiger Laser Service; Olching Germany
    Ulrich Radel, Topag Lasertechnik Gmbh; Darmstadt Germany
    Siegfried Pause, Llt Applikation Gmbh; Ilmenau Germany
    Presented at ICALEO 2013

    We report on new industrial process developments and applications using an ultrashort pulse laser system with a mean power of 15 Watt and the ability to produce femtosecond to picosecond laser pulses with high pulse energies at 1030 nm, 515 nm, 343 nm and 257 nm in a single compact unit.
    Precise and reproducible structuring of thin-film (CI...

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  • ICALEO 2013 Paper #M405 (Laser Micromachining of Bio-Absorbable Polymers: Impact of the Laser Process Parameters on the Machining Throughput and quality)

    Laser Micromachining of Bio-Absorbable Polymers: Impact of the Laser Process Parameters on the Machining Throughput and quality
    Authors:
    Victor Matylitsky, High Q Laser GmbH; Rankweil Austria
    Frank Hendricks, High Q Laser Gmbh; Rankweil Austria
    Rajesh Patel, Spectra Physics; Sanat Clara CA USA
    Presented at ICALEO 2013

    High average power, high repetition rate femtosecond lasers with µJ pulse energies are increasingly used for material processing applications. With the introduction of femtosecond laser systems such as the SpiritTM platform developed by High Q Lasers and Spectra-Physics, micro-processing of solid targets with femtosecond laser pulses have obtained ne...

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  • ICALEO 2013 Paper #M404 (Beam Shaping Unit for Microprocessing on the Base of Refractive Beam Shapers)

    Beam Shaping Unit for Microprocessing on the Base of Refractive Beam Shapers
    Authors:
    Alexander Laskin, Adloptica; Berlin Germany
    Gintas Slekys, Altechna; Vilnius Lithuania
    Nerijus Siaulys, Altechna; Vilnius Lithuania
    Vadim Laskin, Adloptica; Berlin Germany
    Presented at ICALEO 2013

    Spatial beam shaping is very important in various laser microprocessing techniques like scribing, PCB drilling and others where scanning over working field with using galvo mirror scanners is used. Therefore, combining of beam shaping optics, converting Gaussian to flattop (uniform) laser beam irradiance profile, with scanning optical heads is an insistent technical task. As a p...

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  • ICALEO 2013 Paper #M403 (Sapphire Cutting with Pulsed Fiber Lasers)

    Sapphire Cutting with Pulsed Fiber Lasers
    Authors:
    Christoph Ruettimann, LASAG AG; Thun Switzerland
    Noemie Dury, Rofin-Lasag Ag; Thun Switzerland
    Colin Woratz, Rofin-Lasag Ag; Thun Switzerland
    Stefan Woessner, Manz Ag; Reutlingen Germany
    Presented at ICALEO 2013

    Sapphire cutting is currently one of the largest emerging markets in laser materials processing. Sapphire is one of the hardest existing transparent materials. Its mechanical and optical properties made it the ideal and precious choice for various components like cover glasses of watches, displays of mobile devices, protection windows for cameras, or LED carriers. Sapphire cutting with solid state ...

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  • ICALEO 2013 Paper #M402 (Industrial Femtosecond Laser Systems and Applications in Precision Machining of Glass and Metal)

    Industrial Femtosecond Laser Systems and Applications in Precision Machining of Glass and Metal
    Authors:
    Michael Mielke, Raydiance, Inc.; Petaluma CA USA
    X Peng, Raydiance, Inc.; Petaluma CA USA
    K Kim, Raydiance, Inc.; Petaluma CA USA
    D Gaudiosi, Raydiance, Inc.; Petaluma CA USA
    M Greenberg, Raydiance, Inc.; Petaluma CA USA
    M Shirk, Raydiance, Inc.; Petaluma CA USA
    E Juban, Raydiance, Inc.; Petaluma CA USA
    W Lee, Raydiance, Inc.; Petaluma CA USA
    G Masor, Raydiance, Inc.; Petaluma CA USA
    X Gu, Raydiance, Inc.; Petaluma CA USA
    R Lu, Raydiance, Inc.; Petaluma CA USA
    M Hamamo...

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  • ICALEO 2013 Paper #M401 (High Density Through Glass Vias for Advanced Chip Packaging)

    High Density Through Glass Vias for Advanced Chip Packaging
    Authors:
    Rainer Paetzel, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
    Ralph Delmdahl, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
    Rolf Senczuk, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
    Jan Brune, Coherent Lasersystems Gmbh & Co. Kg; Goettingen Germany
    Presented at ICALEO 2013

    Glass is a promising material from which advanced interposers for high density electrical interconnects for 2.5D chip packaging can be produced. The supply of ultra-thin glass wafers with thicknesses of 100 µm and below is cost-comparable relative to polished thin wafers made of sili...

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