• ICALEO 2013 Paper #M807 (Processing Various Sensible High-Tech Materials with Short and Ultra-Short Pulsed Disc Laser Sources)

    Processing Various Sensible High-Tech Materials with Short and Ultra-Short Pulsed Disc Laser Sources
    Authors:
    Markus Roehner, Jenoptik Laser GmbH; Jena Germany
    Susanna Friedel, Jenoptik Laser Gmbh; Jena Germany
    Bert Kremser, Jenotik Laser GmbH; Jena Germany
    Klaus Stolberg, Jenoptik Laser Gmbh; Jena Germany
    Ewa Ziolkowski, Jenotik Laser GmbH; Jena Germany
    Presented at ICALEO 2013

    This presentation gives a brief overview about new applications with high power disc lasers in the ns- and fs-range.

    Ultra-short-pulsed lasers become more and more important in the recent years. Due to their huge peak power in combination with the ultra short pulse...

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  • ICALEO 2013 Paper #M805 (Robusteness of the Laser Melting Process)

    Robusteness of the Laser Melting Process
    Authors:
    Heiko Bruening, Bias - Bremer Institut Fuer Angewandte Strahltechnik Gmbh; Bremen Germany
    Presented at ICALEO 2013

    The use of laser technologies in material processing is wide spread in various manufacturing chains such as welding, brazing and cutting. Compared to other heat sources, the laser beam enables the allocation of a certain amount of energy in a specific time on a very small spot. For this reason, the laser especially is a suitable tool for material processing in micro range. Due to the fact that processes in micro range are rather influenced by forces related to the surface of the work piece than by forces related to their volume, a p...

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  • ICALEO 2013 Paper #M708 (Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation)

    Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation
    Authors:
    Jeonghong Ha, POSTECH; POHANG South Korea
    Dongsik Kim, POSTECH; Pohang South Korea
    Presented at ICALEO 2013

    Carbon nanotubes (CNTs) have great electrical, mechanical and thermal properties compared to conventional materials. However, the naturally-bundled structure, lattice imperfections and impurities seriously limit their engineering applications. There have been attempts to use laser beams to remove the imperfections and impurities but the interaction between high-power laser pulses and CNT structures is still vaguely understood. In this work, the structural changes in single-walled...

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  • ICALEO 2013 Paper #M707 (High Precision 2.5D Laser Cutting of Thin Nitinol and Polyurethane for Medical Applications)

    High Precision 2.5D Laser Cutting of Thin Nitinol and Polyurethane for Medical Applications
    Authors:
    Frank Zibner, Fraunhofer Institute for Laser Technology ; Aachen Germany
    Joachim Ryll, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Jens Holtkamp, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Arnold Giller, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Presented at ICALEO 2013

    High precision laser cutting is extensively used in many medical applications. Materials like polyurethane and nitinol operate as catheters, heart valves, stents or systems combined of both materials. Industrial cutting machines that c...

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  • ICALEO 2013 Paper #M706 (Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades)

    Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades
    Authors:
    Philipp von Witzendorff, Laser Zentrum Hannover e.V.; Hannover Germany
    Oliver Suttmann, Laser Zentrum Hannover E.V.; Hannover Germany
    Ludger Overmeyer, Laser Zentrum Hannover E.V.; Hannover Germany
    Manuel Stompe, Leibniz University Hanover; Garbsen Germany
    Lutz Rissing, Leibniz University Hanover; Garbsen Germany
    Presented at ICALEO 2013

    Cutting of hard and brittle materials as Sintered Silicon Carbide (SSiC) is an obstacle for implementing SSIC into MEMS applications. Wear and accuracy loss of resin-bonded diamond blades are significant. In contrast...

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  • ICALEO 2013 Paper #M704 (Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation)

    Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation
    Authors:
    Ilya Mingareev, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Tobias Bonhoff, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Nils Gehlich, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Ashraf El-Sherif, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Christian Gaida, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Pankaj Kadwani, Townes Laser Institute, University of Central Florida; Orlando FL USA
    Martin Gebhardt, Townes Laser Institu...

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  • ICALEO 2013 Paper #M703 (Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser)

    Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser
    Authors:
    Yasuhiro Okamoto, Okayama University; Okayama Japan
    Kento Shirasaya, Okayama University; Okayama Japan
    Ryoji Kitada, Okayama University; Okayama Japan
    Akira Okada, Okayama University; Okayama Japan
    Presented at ICALEO 2013

    The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur in the case of themosensitive materials due to the thermal damage, since the laser beam processing is mainly thermal proc...

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  • ICALEO 2013 Paper #M605 (Laser Joining of Charge-Collection Tapes Onto Cigs Photovoltaics Modules)

    Laser Joining of Charge-Collection Tapes Onto Cigs Photovoltaics Modules
    Authors:
    Ralf Nett, Ruhr-Universitaet Bochum, Applied Laser Technolgy; Bochum Germany
    Kerstin Kowalick, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
    Manuel Joop, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
    Benjamin Schoeps, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
    Andreas Ostendorf, Ruhr-Universitaet Bochum, Applied Laser Technology; Bochum Germany
    Christoph Ruettimann, Rofin-Lasag AG; Thun Switzerland
    David Bremaud, FLISOM AG; Duebendorf Switzerland
    Presented at ICALEO 2013

    C...

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  • ICALEO 2013 Paper #M604 (Extension of the Process Boundaries for the Soldering of Elongated Interconnectors with a Simultaneous Energy Deposition)

    Extension of the Process Boundaries for the Soldering of Elongated Interconnectors with a Simultaneous Energy Deposition
    Authors:
    Simon W. Britten, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Wolfgang Fiedler, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Alexander Olowinsky, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Arnold Gillner, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
    Presented at ICALEO 2013

    Soldering processes are used to bond elongated interconnectors to metallized silicon wafers e.g. solar cells. The minimal process time is expected to be limited due to the maximal therm...

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  • ICALEO 2013 Paper #M603 (Remote Micro Welding with Multi-Mode and Single-Mode Fiber Lasers - a Comparison)

    Remote Micro Welding with Multi-Mode and Single-Mode Fiber Lasers – a Comparison
    Authors:
    Andreas Patschger, Ernst-Abbe-Fachhochschule Jena; Jena Germany
    Michael Guepner, Ernst-Abbe-Fachhochschule Jena; Jena Germany
    Jens Bliedtner, Ernst-Abbe-Fachhochschule Jena; Jena Germany
    Jean Pierre Bergmann, Technische Universitaet Ilmenau; Ilmenau Germany
    Presented at ICALEO 2013

    Both, multi-mode and single-mode lasers are well established in welding applications. In micro welding, single-mode lasers are often used while multi-mode lasers are more common regarding welding tasks in macro range. However, multi-mode lasers provide several advantages. Focal shifts du...

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