Department of Physics, University of California, Berkeley, California 94720
Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, People's Republic of China and Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, People's Republic of China
Key Laboratory for Advanced Manufacturing by Materials Processing Technology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, People's Republic of China
JLA Vol:22 Iss:4 (Effect of laser and laser hybrid welding on the corrosion performance of a lean duplex stainless steel)
Elin M. Westin
Outokumpu Stainless AB, Avesta Research Center, P.O. Box 74, 774 22 Avesta, Sweden
Laser Processing Laboratory, Lappeenranta University of Technology, Tuotantokatu 2, 53850 Lappeenranta, Finland
The use of duplex stainless steel increases steadily worldwide and the fluctuations in nickel price the recent years have contributed to further growth. The lean duplex grade Outokumpu LDX 2101® (EN 1.4162, UNS S32101) has a low nickel content and is alloyed with nitrogen and manganese to give a balanced microstructure. It means that good austenite formation is obtained even when laser welding autogenously (without fille...
Fraunhofer‐Institut fu¨r Lasertechnik, Aachen, Germany
Joakim Ilsing Sørensen
Flemming O. Olsen
Manufacturing Engineering and Management, Materials and Process Technology, Technical University of Denmark, Building 425, DK-2800 Lyngby, Denmark
In this article, a new approach based on induction heat treatment of flat laser welded sheets is presented. With this new concept, the ductility of high strength steels GA260 with a thickness of 1.8 mm and CMn with a thickness of 2.13 mm is believed to be improved by prolonging the cooling time from 750 to 450 °C. Initially, a simple analytical model was used to calculate the ideal energy contributions from a CO2 high power laser s...
JLA Vol:19 Iss:4 (Ablation and cutting of silicon wafer and micro-mold fabrication using femtosecond laser pulses)
Wuhan National Laboratory for Optoelectronics and School of Optoelectronics Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, People’s Republic of China
Femtosecond laser micromachining of silicon wafer at a relatively higher energy fluence level (>50 J/cm2) is investigated. Laser ablating spots and cutting kerfs are examined by means of charge coupled device camera and scanning electron microscopy. The area of ablated spots increases linearly with increasing the shot number from 1 to 16 and shows saturation with t...
JLA Vol:9 Iss:4 (Dual wavelength laser beam alloying of aluminum alloy for enhanced corrosion resistance)
K. G. Watkins
W. M. Steen
M. G. Ferreira
Aluminum alloys are known for their poor resistance to localized attack and, in particular, for pitting in chloride‐containing electrolytes. In this paper, improvement of the pitting corrosion resistance of 2014‐T6 aluminum alloy has been investigated by means of laser surface alloying of Cr into the substrate. Since aluminum is a highly reflective and thermally conductive material, it is often difficult to process with laser beams. Oxide films on the surface can prevent surface alloying as with the case of Cr alloying into aluminum by in‐situ...
A. Roy Henderson
Bioptica, St. John's Innovation Park, Cambridge U.K.
Pravansu S. Mohanty
Center for Laser Aided Intelligent Manufacturing, Department of Mechanical Engineering and Applied Mechanics, The University of Michigan, Ann Arbor, Michigan 48109-2125
In laser drilling and keyhole welding, multiple reflection phenomena determine how the energy is transferred from the laser beam to the workpiece, and, most importantly, all other physics such as fluid flow, heat transfer, and the cavity shape itself depend on these phenomena. In this study, a multiple reflection model inside a self-consistent (or self-evolving) cavity has been developed based on the level set method and ray tracing t...
Photonics and Materials Research Department, Institute of Research and Innovation, 1201 Takada, Kashiwa, Chiba 277-0861, Japan
DISCO Corporation, 13-11 Omori-Kita 2-chome, Ota-ku, Tokyo 143-8580, Japan
LINTEC Corporation, 5-14-42 Nishiki-cho, Warabi-shi, Saitama 335-0005, Japan
Saitama University, 255-Shimo-okubo, Sakura-ku, Saitama-shi, Saitama 338-8570, Japan
We have developed a new laser ablation process using a water-microdrop with a diameter of 70 μm....
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