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Product Code: ICA13_M502

Silicon Laser Micro-processing of New Energy Source Materials
Jun Duan, Huazhong University of Science and Technology; Wuhan
Huan Yang, Huazhong University of Science and Technology; Wuhan Peoples Republic of China
Xiaoyan Zeng, Huazhong University of Science and Technology; Wuhan
Leiming Deng, Huazhong University of Science and Technology; Wuhan
Presented at ICALEO 2013

In recent years, laser micromachining of semiconductor materials such as silicon and sapphire has attracted more and more attention. High power Diode Pumped Solid State (DPSS) lasers have been gained wider application in microelectronics, flat panel display, and solar cell manufacturing industries because it can obtain smaller feature sizes, higher throughput and lower costs. The works on typical applications of 355nm DPSS UV laser micro-processing new energy source materials have been introduced in this paper, including microprocessing carried out on fluorine-doped tin oxide (FTO) thin film and polyimide membrane to investigate the etching accuracy and depth with different laser processing modes and parameters in order to meet the technologic requirement of laser micromachining. Another important work introduced in this paper is laser selectively sintering TiO2 films for dye-sensitized solar cells (DSSCs). The effects of parameters (average power, repetition rate, scanning speed and scan spacing) on the on the micro-processing quality and precision have been investigated and analysed. The incident photon-to-electron conversion efficiency and the current-voltage characteristic of the DSSC were also determined.


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