Product Code: ICA12_M505
CO2 Laser Free-Shape Cutting of Flexible Glass Substrates
Xinghua Li, Science and Technology, Corning Incorporated; Corning NY USA
Sean M. Garner, Science and Technology, Corning Incorporated; Corning NY USA
Presented at ICALEO 2012
We investigated CO2 laser free-shape cutting of flexible glass substrates. The technique uses tensile stress to propagate a full-body crack along the perimeter of the device to be cut. The tensile stress was generated by the CO2 laser heating and subsequent ambient air cooling process. A round laser beam was rapidly (>10 m/s) scanned along the perimeter of the device using an optical scanner. The rapidly moving laser beam generates a fast moving tensile stress field during the process and a free-shape device was cut out in few seconds. We present free-shape cutting examples on flexible glass substrates and edge strength evaluations on samples prepared with the method.
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