Product Code: ICA12_1809
On the Interaction of the Particles of Tantalum with a Substrate of Copper in the Cold Spray Bonding Process
Anass Nifa, PIMM, UMR 8006 CNRS Arts et Métiers; paris France
Laurent Berthe, PIMM, UMR 8006 CNRS Arts et Métiers; Paris France
Michel Boustie, PPRIME UPR 3346 ENSMA; Poitiers France
Laure-Line Descurninges, Centre des Matériaux; Evry France
Michel Jeandin, Centre des Matériaux; -
Jacky Bénier, CEA, DAM DIF; -
Patrick Mercier, CEA, DAM DIF; -
Presented at ICALEO 2012
Cold gas spraying is a relatively new deposition process in which coatings can be produced without significant heating of the sprayed powder. In contrast to the well-known thermal spray processes such as spray flame and plasma, in cold spray there is no melting of particles prior to impact on the substrate. The adhesion in this process is due solely to the kinetic energy upon the impact. The adhesion usually occurs for particles between 5 and 100 μm diameter sprayed at supersonic velocities, typically between 300 and 1500 m/s. Experimental investigations show that successful bonding is achieved only above a critical velocity, that depends on
the temperature and physical properties of the sprayed material.
For the study of Particle/substrate interaction in the cold-spray bonding process , an experimental simulation of the particle-substrate reactions at the particle impingement was developed. This simulation is based on laser shock experiments. We used a system of cameras to visualize the state of the interface Tantalum/Copper in different times.
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