Product Code: ICA11_M1107

Trends and Advances in UV-Laser Microprocessing
Authors:
Ralph Delmdahl, Coherent GmbH; Goettingen Germany
Presented at ICALEO 2011

Lasers with ultraviolet (UV) output offer unique benefits for processing a wide range of materials. In particular, the short wavelength, high energy UV photons experience less diffraction than longer visible or infrared wavelengths, which enables materials processing at higher spatial resolution. In addition, UV-laser wavelengths interact primarily by non-thermal means, thus minimizing the heat affected zone during manufacturing.
UV-excimer lasers deliver energies scalable up to 2J/pulse and output powers above one kilowatt. Thus, they are the key to fast and effective large area surface processing with structure dimensions as small as one micron. Excimer lasers are ideal for repetitive and dense patterning of large substrates. For drilling, scribing and cutting type applications pulsed, high repetition rate solid state lasers with UV frequency conversion provide the necessary flexibility and processing speed.
While the choice of either of the two basic illumination strategies is determined by the application, the overall trend toward better machining resolution and precision drives industrial laser processing with UV wavelengths.