Product Code: ICAL09_P111

An Overview of the Conventional Microprocessing and Laser Assisted Techniques for Fabricating Microscale Features
Authors:
Antti Salminen, Lappeenranta University of Technology, Laser Processing Research Group (Laboratory of Welding Technology and Laser Processing), Lappeenranta, Finland; Lappeenranta Finland
Heidi Piili, Lappeenranta University of Technology, Laser Processing Research Group (Laboratory of Welding Technology and Laser Processing), Lappeenranta, Finland; Lappeenranta Finland
Heidi Piili, LUT Laser, Lappeenranta University of Technology; Lappeenranta Finland
Matti Manninen, Lappeenranta University of Technology, Laser Processing Research Group (Laboratory of Welding Technology and Laser Processing), Lappeenranta, Finland; Lappeenranta Finland
Presented at ICALEO 2009

In this literature review conventional manufacturing methods and techniques for microscale processing units are introduced and compared to laser micromachining. Conventional techniques studied includes wet bulk etching, many dry etching techniques, LIGA processes, abrasive jet machining, electrical discharge machining, microultrasonic machining, and mechanical micromachining. Compared to these methods, laser microprocessing is a new method. However, during last decade the novel advantages of laser micro processing have raised much interest and many scientific studies. These studies show that, with correct parameters, laser can be used to fabricate very small features that can be utilized in microscale processing. In larger scale components even laser cutting can compete with the conventional processes. Especially excimer and fiber lasers are seen as potential candidates, former being the more costly but also more well-known and arguably more capable choice. Other lasers included are Nd:YAG, Nd:YVO4, and Ti:sapphire solid-state lasers.