Product Code: ICAL09_M303

Spatial Micro-Processing of Mono-Crystallin Silicon with Hybrid Chemical–Laser Etching Method in KOH with the Use of Fiber Laser
Authors:
Adam Rosowski, Technical University of Lodz; Lodz Poland
Heidi Piili, Lappeenranta University of Technology; Lappeenranta Finland
Ryszard Pawlak, Technical University of Lodz; Lodz Poland
Veli Kujanpaa, Lappeenranta University of Technology and VTT; Lappeenranta Finland
Antti Salminen, Lappeenranta University of Technology; Lappeenranta Finland
Presented at ICALEO 2009

This study presents a hybrid technology of chemical and laser spatial processing (HCL) for spatial micro-processing of monocrystalline silicone. It is based on conducting the process of processing by etching liquid with simultaneous use of laser beam on the areas being etched. The laser beam changes the temperature field of material and liquid, locally activates the surface of the material decreasing the activating energy required for its etching and increases activity of etching liquid. It enables creating structures of high quality together with significantly higher velocity of etching compared to pure etching as well as removing intermediate critical processes connected for example with masking required in etching. This study shows the results of hybrid chemical and laser etching (HCLE) of silicone in solution of KOH with the use of fiber laser with the emitted wave length of 1070 nm. The process is functional both in continuous and pulsed mode. Influence of laser beam and etching liquid parameters on created structures has been examined and evaluated. Subsequently, the results have been compared with the structures created with the results gained by use of direct classic laser machining as well as chemical processing.