Product Code: ICAL08_203

Reliable Cooling of High-power Laser Diode Arrays
Authors:
Ryan Feeler, Northrop Grumman / Cutting Edge Optronics; St. Charles MO USA
Ed Stephens, Northrop Grumman / Cutting Edge Optronics; St. Charles MO USA
Greg Kemner, Northrop Grumman / Cutting Edge Optronics; St. Charles MO USA
Jay Doster, Northrop Grumman Cutting Edge Optronics; St. Charles MO USA
Jeremy Junghans, Northrop Grumman / Cutting Edge Optronics; St. Charles MO USA
Presented at ICALEO 2008

Northrop Grumman / Cutting Edge Optronics has developed a line of microchannel-cooled laser diode arrays in which the coolant is electrically isolated from the current path. As a result, these arrays do not require the use of deionized water. The thermal performance of these arrays is presented and, in one case, shown to far exceed the performance of standard copper microchannel-cooled packages. This sets them apart from other non-DI microchannel coolers currently on the market which typically have worse thermal performance than copper MCCs.

These newly-developed coolers are based on multi-layer ceramic technology and are compatible with other technologies developed by NGCEO that enable long lifetimes under harsh operating conditions. In particular, these arrays can be assembled using hard-solder technology that enables power-cycled and high-current operation. The soldering technology also generates arrays that are easily lensed and satisfy a wide range of direct diode needs, including welding, marking, and complex line generation applications.

These microchannel-cooled arrays represent an important next step in the solid state laser industry. They allow for much simpler (non-deionized) cooling systems while maintaining excellent thermal performance and lifetimes.