Product Code: ICAL07_M602
Laser-Based Glass Soldering for MEMS Packaging
Alexander Olowinsky, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Cédric Chaminade, Fraunhofer Institute for Laser Technology ILT; Aachen Germany
Heidrun Kind, Fraunhofer Ilt; Aachen Germany
Presented at ICALEO 2007
The continuous trend of miniaturization coupled with an increasing thermal weakness of electronic components requires an improvement of the thermal heat input accuracy during packaging processes. As of today, high power laser techniques provide a localized, reproducible and highly controllable energy input. The work carried out in this study deals with the development of a laser based glass soldering process. This process is applied to the assembly of two glass plates as encountered in the manufacturing of display devices. The main guidelines of the laser process setting up are mainly to avoid any overheating of the parts and to insure a hermetic bonding of the assembly. First, this study describes the laser process characteristics: laser tool (laser equipped with a scanner head), laser parameters (for different joint geometries) and environment specifications (i.e. stand nature and geometry). Then, Finite Element Modeling (FEM) analyses are carried out in order to evaluate the temperature distribution in the assembly during the laser process. This numerical analysis is also used to highlight the limitations of the use of a single laser beam with a high velocity. Finally, results of the microscopy assessments of the glass joint are presented.
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