• ICALEO 2005 Paper #M107 (Patterning of ITO Film by Femtosecond Laser Ablation)

    Patterning of ITO Film by Femtosecond Laser Ablation
    Authors:
    Dave Farson, Ohio State University; Columbus OH USA
    Hae Choi, Ohio State University; Columbus OH USA
    Kwang Kim, LG Electronics; Pyungtaek-si Kyunggi-Do Korea
    Presented at ICALEO 2005

    Indium tin oxide (ITO) is commonly used in flat panel display applications. The ITO needs to be patterned to form pixels and direct write laser ablation is widely used for this purpose. In this investigation, femtosecond laser patterning of ITO was studied to identify laser processing parameters which cleanly ablated ITO with a minimum of damage to substrate glass and surrounding ITO. Soda-lime glass with an ITO film of approxim...

    $28.00

  • ICALEO 2005 Paper #M106 (Research on Direct Laser Patterning of Thin Films for Flat-panel Display)

    Research on Direct Laser Patterning of Thin Films for Flat-panel Display
    Authors:
    Reo Usui, Osaka University; Minoh, Osaka Japan
    Ryohei Satoh, Osaka University; Suita, Osaka Japan
    Haruyoshi Iwata, Osaka University; Suita, Osaka Japan
    Koji Nakagawa, Osaka University; Suita, Osaka Japan
    Eiji Morinaga, Osaka University; Suita, Osaka Japan
    Satoru Takaki, Osaka University; Osaka, Suita Japan
    Presented at ICALEO 2005

    On a microcircuit pattern, which is necessary for fabricating electrical devices such as plasma display and liquid crystal display, the wet process which utilizes lithography technology is commonly employed. The wet process...

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  • ICALEO 2005 Paper #M105 (New Ultrafast High-Energy Laser Concepts and their Applications)

    New Ultrafast High-Energy Laser Concepts and their Applications
    Authors:
    Wolfgang Seitz, High Q Laser (US), Inc.; Watertown MA USA
    Alexander Killi, Max-Planck-Institut fr Kernphysik; Heidelberg Germany
    Heinz Huber, High Q Laser Production GmbH; Hohenems Austria
    Max Lederer, High Q Laser Production GmbH; Hohenems Austria
    Uwe Morgner, Max-Planck-Institut fr Kernphysik; Heidelberg Germany
    Presented at ICALEO 2005

    Ultrafast laser systems with pulse durations in the femto- and picosecond regime have proven their potential in several material processing applications. So far, a lot of these applications have been limited by the costly and difficult...

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  • ICALEO 2005 Paper #M103 (Laser Processing of Optical Materials: Drilling, Dicing and Modifying Thin Glass (Invited Paper))

    Laser Processing of Optical Materials: Drilling, Dicing and Modifying Thin Glass (Invited Paper)
    Authors:
    David Ashkenasi, LMTB; Berlin Germany
    Presented at ICALEO 2005

    Laser processing of optical materials is becoming increasingly important. In addition to infrared CO2-laser stress-related dicing of float glass, applications using DPSSL lasers are slowly coming into focus of attention. Utilizing non-linear absorption channels, ns-pulsed green (532nm) laser light can actually drill and cut glass in different thickness, depending on fluence, feed rate and pulse width. This characterizes a very interesting processing alternative for certain types of optical materials and/or geometric conditions, ...

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  • ICALEO 2005 Paper #907 (High Power Diode Laser-Assisted Fiber Placement of Composite Structure)

    High Power Diode Laser-Assisted Fiber Placement of Composite Structure
    Authors:
    John Haake, Nuvonyx, Inc; Bridgeton MO USA
    Presented at ICALEO 2005

    The hot-gas heating systems used on today's production automated fiber/tape placement machines provide limited heating efficiency and poor process control response that prevents placement machines from achieving the full production rates. We have has demonstrated high power diode laser-based heating system, that provides photons for the most efficient heating method radiative. This yields higher processing rates, high control bandwidth, and lower maintenance cost than existing heating technologies. The standard high power direct diode laser integ...

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  • ICALEO 2005 Paper #905 (Productivity Issues in Diode Laser Transformation Hardening)

    Productivity Issues in Diode Laser Transformation Hardening
    Authors:
    Henrikki Pantsar, VTT Industrial Systems; Lappeenranta Finland
    Presented at ICALEO 2005

    The productivity in laser transformation hardening is a complex combination of physics and metallurgy. In many laser processes higher productivity is achieved by increasing the laser power together with the process velocity. In laser transformation hardening the material should remain in the solid state and the use of laser power is limited. Metallurgical transformations are based on kinetics and in order to achieve a given hardness the processing speed can be increased only within certain limits. Many parameter combinations can lead to the...

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  • ICALEO 2005 Paper #903 (Highly Reliable Diode Ensembles for Direct Diode Applications and Pumping Solid-State Lasers)

    Highly Reliable Diode Ensembles for Direct Diode Applications and Pumping Solid-State Lasers
    Authors:
    Andrew Leuzinger, JDS Uniphase; Santa Rosa CA USA
    Presented at ICALEO 2005

    High power (>20W) diode laser systems provide a relatively low-cost source of coherent radiation that is ideal for non-contact heating applications such as plastic welding, epoxy curing, heat treatment, selective soldering, and brazing. These applications generally require the diodes to be cycle on/off at frequency in the 0.25-4 Hz range. Historically bar diodes have been used in these applications. However, bar diode lifetimes are limited to around 10,000 to 15,000 hours when operated in a CW mode, and can be conside...

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  • ICALEO 2005 Paper #902 (Heat Conduction Welding of Thin Films with Elliptical Beam of Direct Diode Laser)

    Heat Conduction Welding of Thin Films with Elliptical Beam of Direct Diode Laser
    Authors:
    Nobuyuki Abe, Osaka University; Ibaraki, Osaka Japan
    Masahiro Tsukamoto, Osaka University; Ibaraki Osaka Japan
    Takashi Imanaka, Osaka University; Ibaraki Osaka Japan
    Yoshinori Funada, Industrial Research Institute of Ishikawa; Kanazawa Ishikawa Japan
    Presented at ICALEO 2005

    Recently there has been a growing trend toward miniaturization of electronics and mechanical parts to reduce energy consumption and achieve greater compactness. In order to respond to such demands, the development of an advanced welding method is required for welding thin foil 100 microns or les...

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  • ICALEO 2005 Paper #901 (Development Trends of High Power Diode Lasers and Resulting Perspectives for Applications (Invited Paper))

    Development Trends of High Power Diode Lasers and Resulting Perspectives for Applications (Invited Paper)
    Authors:
    Reinhart Poprawe, Fraunhofer Institute for Laser Technology; Aachen Germany
    Christian Wessling, Fraunhofer-Institute fr Laser Technology; Aachen Germany
    Peter Loosen, Fraunhofer-Institute fr Laser Technology; Aachen Germany
    Presented at ICALEO 2005

    High Power Diode Lasers have been used for years in low power density applications. The lack of sufficient beam quality an life times in the range of a few thousand hours limited their applicability severely. However, in the past years the intrinsic beam quality in terms of divergence, smile and stability as w...

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  • ICALEO 2005 Paper #806 (Study of Polymers Laser Grooving by Using the Analysis of Variance Method)

    Study of Polymers Laser Grooving by Using the Analysis of Variance Method
    Authors:
    Adelina Han, LTm; Chalon Sur Saone France
    Alexandru Nichici, University Politechnic of Timisoara; Timisoara Romania
    Dominique Grevey, LTm; Le Creusot France
    Gianni Pillon, LTm; Chalon Sur Saone France
    Presented at ICALEO 2005

    Although polymers laser processing is a relative recently technological procedure, the remarkable results obtained are encouraging the continuation of the researches with the purpose of extending its utilization. Laser processing is difficult to control because of the nature and complexity of the phenomena and processes that are developing among the las...

    $28.00

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