ICALEO 2013 Paper #M703 (Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser)

Singulation of Semiconductor Package by Superposition of Pulsed Fiber Laser and Green Yag Laser
Authors:
Yasuhiro Okamoto, Okayama University; Okayama Japan
Kento Shirasaya, Okayama University; Okayama Japan
Ryoji Kitada, Okayama University; Okayama Japan
Akira Okada, Okayama University; Okayama Japan
Presented at ICALEO 2013

The application of laser beam processing has been expected in the field of semiconductor devices because of its flexible cutting line and narrow kerf width. However, the deterioration of cutting quality would occur in the case of themosensitive materials due to the thermal damage, since the laser beam processing is mainly thermal proc...

ICALEO 2013 Paper #M704 (Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation)

Trans-Wafer Processing of Semiconductors with Nanosecond Mid-Ir Laser Radiation
Authors:
Ilya Mingareev, Townes Laser Institute, University of Central Florida; Orlando FL USA
Tobias Bonhoff, Townes Laser Institute, University of Central Florida; Orlando FL USA
Nils Gehlich, Townes Laser Institute, University of Central Florida; Orlando FL USA
Ashraf El-Sherif, Townes Laser Institute, University of Central Florida; Orlando FL USA
Christian Gaida, Townes Laser Institute, University of Central Florida; Orlando FL USA
Pankaj Kadwani, Townes Laser Institute, University of Central Florida; Orlando FL USA
Martin Gebhardt, Townes Laser Institu...

ICALEO 2013 Paper #M706 (Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades)

Investigation of the Cutting Performance of Laser Dressed Metal Bonded Diamond Blades
Authors:
Philipp von Witzendorff, Laser Zentrum Hannover e.V.; Hannover Germany
Oliver Suttmann, Laser Zentrum Hannover E.V.; Hannover Germany
Ludger Overmeyer, Laser Zentrum Hannover E.V.; Hannover Germany
Manuel Stompe, Leibniz University Hanover; Garbsen Germany
Lutz Rissing, Leibniz University Hanover; Garbsen Germany
Presented at ICALEO 2013

Cutting of hard and brittle materials as Sintered Silicon Carbide (SSiC) is an obstacle for implementing SSIC into MEMS applications. Wear and accuracy loss of resin-bonded diamond blades are significant. In contrast...

ICALEO 2013 Paper #M707 (High Precision 2.5D Laser Cutting of Thin Nitinol and Polyurethane for Medical Applications)

High Precision 2.5D Laser Cutting of Thin Nitinol and Polyurethane for Medical Applications
Authors:
Frank Zibner, Fraunhofer Institute for Laser Technology ; Aachen Germany
Joachim Ryll, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Jens Holtkamp, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Arnold Giller, Fraunhofer Institute for Laser Technology Ilt; Aachen Germany
Presented at ICALEO 2013

High precision laser cutting is extensively used in many medical applications. Materials like polyurethane and nitinol operate as catheters, heart valves, stents or systems combined of both materials. Industrial cutting machines that c...

ICALEO 2013 Paper #M708 (Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation)

Structural Changes in Single-Walled Carbon Nanotubes Induced by Pulsed Laser Irradiation
Authors:
Jeonghong Ha, POSTECH; POHANG South Korea
Dongsik Kim, POSTECH; Pohang South Korea
Presented at ICALEO 2013

Carbon nanotubes (CNTs) have great electrical, mechanical and thermal properties compared to conventional materials. However, the naturally-bundled structure, lattice imperfections and impurities seriously limit their engineering applications. There have been attempts to use laser beams to remove the imperfections and impurities but the interaction between high-power laser pulses and CNT structures is still vaguely understood. In this work, the structural changes in single-walled...

ICALEO 2013 Paper #M805 (Robusteness of the Laser Melting Process)

Robusteness of the Laser Melting Process
Authors:
Heiko Bruening, Bias - Bremer Institut Fuer Angewandte Strahltechnik Gmbh; Bremen Germany
Presented at ICALEO 2013

The use of laser technologies in material processing is wide spread in various manufacturing chains such as welding, brazing and cutting. Compared to other heat sources, the laser beam enables the allocation of a certain amount of energy in a specific time on a very small spot. For this reason, the laser especially is a suitable tool for material processing in micro range. Due to the fact that processes in micro range are rather influenced by forces related to the surface of the work piece than by forces related to their volume, a p...

ICALEO 2013 Paper #M807 (Processing Various Sensible High-Tech Materials with Short and Ultra-Short Pulsed Disc Laser Sources)

Processing Various Sensible High-Tech Materials with Short and Ultra-Short Pulsed Disc Laser Sources
Authors:
Markus Roehner, Jenoptik Laser GmbH; Jena Germany
Susanna Friedel, Jenoptik Laser Gmbh; Jena Germany
Bert Kremser, Jenotik Laser GmbH; Jena Germany
Klaus Stolberg, Jenoptik Laser Gmbh; Jena Germany
Ewa Ziolkowski, Jenotik Laser GmbH; Jena Germany
Presented at ICALEO 2013

This presentation gives a brief overview about new applications with high power disc lasers in the ns- and fs-range.

Ultra-short-pulsed lasers become more and more important in the recent years. Due to their huge peak power in combination with the ultra short pulse...

ICALEO 2013 Paper #M808 (Temperature Profile in Thin Wires during Laser Heating.)

Temperature Profile in Thin Wires during Laser Heating.
Authors:
Thiwanka Wickramasooriya, Laser-Advanced Manufacturing, Materials and Micro-Processing Laboratory; Orlando FL USA
Aravinda Kar, Laser-Advanced Manufacturing, Materials and Micro-Processing Laboratory; Orlando FL USA
Raj Vaidyanathan, Advanced Materials Processing and Analysis Center; Orlando FL USA
Presented at ICALEO 2013

The temperature distribution in a moving thin wire heated by a rectangular profile laser beam is studied. The output Gaussian profile beam of a laser system is transformed to a rectangular profile beam and the corresponding laser irradiance is integrated in the transverse direction to o...

ICALEO 2013 Paper #M902 (3D Finite Element Modeling of Laser-Assisted Maskless Micro-Deposition)

3D Finite Element Modeling of Laser-Assisted Maskless Micro-Deposition
Authors:
Ehsan Toyserkani, University of Waterloo; Waterloo ON Canada
Amir Azhari, University of Waterloo; Waterloo ON Canada
Elahe Jabari, University of Waterloo; Waterloo ON Canada
Presented at ICALEO 2013

The manuscript will address a 3D finite element modeling of a laser-assisted maskless micro-deposition process (aka micro laser sintering/cladding) where it is utilized in the production of micro-tracks composed of silver nano-particles. The model is established through a coupled heat conduction equation with strain/stress constitutive physics in the presence of a moving continuous or pulsed las...

ICALEO 2013 Paper #M903 (Experimental and Numerical Investigation on Short Pulsed Laser Welding of Stainless Steel Foils)

Experimental and Numerical Investigation on Short Pulsed Laser Welding of Stainless Steel Foils
Authors:
Hui-chi Chen, Singapore Institute of Manufacturing Technology; Singapore Singapore
Presented at ICALEO 2013

Today, there is a miniaturization trend in ultra-precision laser micro-welding applications. It is due to industrial products or components are being made smaller to save space or reduce energy consumptions. For example, laser hermetic sealing of implantable devices, microwave enclosures, batteries, sensors, etc. Since these devices are generally heat-sensitive, a proper control of energy input is necessary in order to avoid any heat damage. Laser micro-welding by pulsed laser systems ...