• ICALEO 2012 Paper #M311 (An Aspherical Reflecting Focusing Method for Direct Semiconductor Laser)

    An Aspherical Reflecting Focusing Method for Direct Semiconductor Laser
    Authors:
    Xubao Wang, Institute of Laser Engineering, Beijing Univ. of Technology; Beijing Peoples Republic of China
    Qinggai Mi, Institute of Laser Engineering, Beijing Univ. of Technology; Beijing Peoples Republic of China
    Dongyu Liu, Institute of Laser Engineering, Beijing Univ. of Technology; Beijing Peoples Republic of China
    Presented at ICALEO 2012

    An aspherical reflecting focusing mirror is designed and applied to reflect and finally focus the laser beam of a laser diodes stack into a spot, whose original beam size in fast axis direction is 22mm with a divergence angle of 0.5 degree, and in sl...

    $28.00

  • ICALEO 2012 Paper #M401 (Welding Characteristics of Foturan Glass Using Ultrashort Laser Pulses - Invited Presentation - 40 Minutes)

    Welding Characteristics of Foturan Glass Using Ultrashort Laser Pulses - Invited Presentation - 40 Minutes
    Authors:
    Isamu Miyamoto, Osaka Univ., Erlangen Graduate School of Advanced Optical Technologies (SAOT); Hyogo Japan
    Kristian Cvecek, blz - Bayerisches Laserzentrum; Erlangen Germany
    Yasuhiro Okamoto, Okayama Univ.; Okayama Jordan
    Michael Schmidt, Erlangen Graduate School of Advanced Optical Technologies (SAOT), blz - Bayerisches Laserzentrum, Erlangen-Nuremberg Univ.; Erlangen Germany
    Henry Helvajian, The Aerospace Corporation; Los Angeles CA USA
    Presented at ICALEO 2012

    Nonlinear absorptivity of Foturan glass to ultrashort
    laser pulses...

    $28.00

  • ICALEO 2012 Paper #M402 (Novel Fusion Welding Technology of Si/Glass Using Ultrashort Laser Pulses with High Pulse Repetition Rates)

    Novel Fusion Welding Technology of Si/Glass Using Ultrashort Laser Pulses with High Pulse Repetition Rates
    Authors:
    Isamu Miyamoto, Osaka Univ., Erlangen Graduate School of Advanced Optical Technologies (SAOT); Suita Japan
    Yashuhiro Okamoto, Okayama Univ.; Okayama Japan
    Assi Hansen, Tampere Univ. of Technology; Tampere Finland
    Tiina Amberla, Corelase Ltd.; Tampere Finland
    Jorma Vihinen, Tampere Univ. of Technology; Tampere
    Jarno Kangastupa, Corelase Ltd.; Tampere Finland
    Presented at ICALEO 2012

    Using ps laser pulses with high pulse repetition rates,
    novel fusion welding technique of Si/glass material
    combination has been deve...

    $28.00

  • ICALEO 2012 Paper #M404 (Examinations on Laser-Welded Joints of Ultra-Thin Metallic Foils)

    Examinations on Laser-Welded Joints of Ultra-Thin Metallic Foils
    Authors:
    Andreas Patschger, Ernst Abbe Univ. of Applied Sciences Jena; Jena Germany
    Matthias Hild, LCP-Laser-Cut-Processing GmbH; -
    Jean Pierre Bergmann, Univ. of Technology Ilmenau; -
    Jens Bliedtner, Ernst Abbe Univ. of Applied Sciences Jena; -
    Presented at ICALEO 2012

    Examinations on joints of ultra-thin foils which are laser-welded through the "Remote" technique were carried out in this paper. The foils were joined with each other as well as with solid bodies. Typical applications of thin metallic foils can be found in the packaging industry, in the building industry as well as in va...

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  • ICALEO 2012 Paper #M406 (Micro-Laser-GMA Hybrid Welding - The Advancement from Macro to Micro Range)

    Micro-Laser-GMA Hybrid Welding – The Advancement from Macro to Micro Range
    Authors:
    Uwe Reisgen, RWTH Aachen Univ., ISF Welding and Joining Institute; -
    Simon Olschok, RWTH Aachen Univ., ISF Welding and Joining Institute; -
    Stefan Jakobs, RWTH Aachen Univ., ISF Welding and Joining Institute; -
    Michael Mavany, RWTH Aachen Univ., ISF Welding and Joining Institute; -
    Presented at ICALEO 2012

    Laser beam welding is characterized by high process speed and low energy input. A shorter processing time and also less distortion are the results. Expensive clamping and subassembly techniques are, however, setting limits to the application scope of laser...

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  • ICALEO 2012 Paper #M502 (Singulation of Sapphire Substrate with High Aspect Ratio Internal Modification by Sub-Nanosecond Pulsed Fiber Laser)

    Singulation of Sapphire Substrate with High Aspect Ratio Internal Modification by Sub-Nanosecond Pulsed Fiber Laser
    Authors:
    Yasuhiro Okamoto, Graduated School of Natural Science and Technology, Okayama Univ.; Okayama Japan
    Kenta Takahashi, Graduated School of Natural Science and Technology, Okayama Univ.; Okayama Japan
    Akira Okada, Graduated School of Natural Science and Technology, Okayama Univ.; Okayama Japan
    Presented at ICALEO 2012

    Sapphire is widely used for the substrate of high brightness LED, and it is important to reduce the edge damage in the singulation process of sapphire substrate for the high quality product and the cost reduction. In this study, the int...

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  • ICALEO 2012 Paper #M504 (Diagnostic and Simulation of ps-Laser Glass Cutting - Invited Presentation - 40 Minutes)

    Diagnostic and Simulation of ps-Laser Glass Cutting - Invited Presentation - 40 Minutes
    Authors:
    Urs Eppelt, Fraunhofer Institute for Laser Technology, Nonlinear Dynamics of Laser Processing, RWTH Aachen Univ.; Aachen Germany
    Simone Russ, TRUMPF Laser GmbH + Co. KG; Schramberg Germany
    Claudia Hartmann, Fraunhofer Institute for Laser Technology; Aachen Germany
    Mingying Sun, Fraunhofer Institute for Laser Technology; -
    Christof Siebert, TRUMPF Laser- und Systemtechnik GmbH; Ditzingen Germany
    Wolfgang Schulz, Fraunhofer Institute for Laser Technology, Nonlinear Dynamics of Laser Processing, RWTH Aachen Univ.; Aachen Germany
    Presented at ICA...

    $28.00

  • ICALEO 2012 Paper #M505 (CO2 Laser Free-Shape Cutting of Flexible Glass Substrates)

    CO2 Laser Free-Shape Cutting of Flexible Glass Substrates
    Authors:
    Xinghua Li, Science and Technology, Corning Incorporated; Corning NY USA
    Sean M. Garner, Science and Technology, Corning Incorporated; Corning NY USA
    Presented at ICALEO 2012

    We investigated CO2 laser free-shape cutting of flexible glass substrates. The technique uses tensile stress to propagate a full-body crack along the perimeter of the device to be cut. The tensile stress was generated by the CO2 laser heating and subsequent ambient air cooling process. A round laser beam was rapidly (>10 m/s) scanned along the perimeter of the device using an optical scanner. The rapidly moving laser beam generates a fast movin...

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  • ICALEO 2012 Paper #M506 (The Impact of Thermal Strain Rate on Laser Bonding of Polymer Films)

    The Impact of Thermal Strain Rate on Laser Bonding of Polymer Films
    Authors:
    Colin Dowding, Lincoln School of Engineering, Univ. of Lincoln; Leicestershire Great Britain
    Presented at ICALEO 2012

    Laser bonding has great potential in numerous industries where process flexibility is required in combination with bond durability, consistency and repeatability. Previously, it has been shown that lasers are ideal for activating the bonding adhesive which then offers a bond force that is independent of laser power. This new work extends our understanding by characterising the bond strength response of the adhesive with respect to laser scan speed. This work confirms that the adhesive requires a thresh...

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  • ICALEO 2012 Paper #M507 (Laser Transmission Welding with Part Adapted Temperature Fields)

    Laser Transmission Welding with Part Adapted Temperature Fields
    Authors:
    Martin Devrient, blz Bayerisches Laserzentrum GmbH; Erlangen USA
    Verena Wippo, LZH Laserzentrum Hannover e.V.; Hannover Germany
    Peter Jaeschke, LZH Laserzentrum Hannover e.V.; Hannover Germany
    Uwe Stute, LZH Laserzentrum Hannover e.V.; -
    Thomas Frick, blz Bayerisches Laserzentrum GmbH; Erlangen Germany
    Heinz Haferkamp, LZH Laserzentrum Hannover e.V.; Hannover Germany
    Michael Schmidt, blz Bayerisches Lasersentrum GmbH, LPT Lehrstuhl Fuer Photonische Technologien der Friedrich-Alexander Univ. Erlangen-Nuernberg; Erlangen Germany
    Presented at ICALEO 2012

    $28.00

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