ICALEO 2010 Paper #M701 (Optimization of UV Laser Scribing Process for LED Sapphire Wafers)

Optimization of UV Laser Scribing Process for LED Sapphire Wafers
Authors:
Ashwini Tamhankar, Spectra-Physics Lasers, Newport Corporation; Santa Clara CA USA
Rajesh Patel, Spectra-Physics Lasers, Newport Corporation; Santa Clara CA USA
Presented at ICALEO 2010

Billions of LEDs are used today in traffic control, automotive headlights, flat panel display technology, mobile devices, back lighting, projection and general illumination applications. With the dramatic growth in LEDs, manufacturers are looking for technologies to increase production yield and decrease cost. Sapphire wafer singulation into miniature dies is one of the critical steps used in blue/green LED manufacturing. Typ...

ICALEO 2010 Paper #M702 (Suppression of Laser Plasma Melting Side Walls in Laser Drilling High Aspect Ratio Microvias)

Suppression of Laser Plasma Melting Side Walls in Laser Drilling High Aspect Ratio Microvias
Authors:
V.N. TOKAREV, A.M.Prokhorov General Physics Institute, Russian Academy of Sciences; Moscow Russia
V.A. Shmakov, A.M. Prokhorov General Physics Institute, Russian Academy of Sciences; Moscow Russia
V.A. Yamschikov, Institute of Electrophysics and Energetics, Russian Academy of Sciences; Sankt-Peterburg Russia
R.R. Khasaya, Institute for Electrophysics and Electric Power, Russian Academy of Sciences; Sankt-Peterburg Russia
S.I. Mikolutski, Institute for Electrophysics and Electric Power, Russian Academy of Sciences; Sankt-Peterburg Russia
Vladislav K...

ICALEO 2010 Paper #M703 (Multi-Wavelength Micromachining of Silicon and Glass by Q-Switched Short Pulsed Lasers)

Multi-Wavelength Micromachining of Silicon and Glass by Q-Switched Short Pulsed Lasers
Authors:
Shiva Gadag, Center for Laser Aided Manufacturing, Southern Methodist University; Dallas TX USA
Radovan Kovacevic, Center for Laser Aided Manufacturing, Southern Methodist University; Dallas TX USA
Presented at ICALEO 2010

Laser Micromachining of semiconductor materials - Silicon wafers, glass and quartz are experimentally investigated using the Spectra Physics diode pumped solid state laser. The Q-switched Nd:YVO4 DPSS laser of fundamental wavelength 1064 nm with high pulsing frequencies (15 300 kHz) and short pulse duration (10 ns) is used for micromachining. Laser drilling of arra...

ICALEO 2010 Paper #M705 (Design of a Microdistillation Column)

Design of a Microdistillation Column
Authors:
Matti Manninen, Lappeenranta University of Technology, Laser Processing Technology Research Group; Lappeenranta Finland
Aarne Sundberg, Aalto University, Department of Biotechnology and Chemical Technology, Faculty of Chemistry and Materials; Espoo Finland
Heidi Piili, Lappeenranta University of Technology, Laser Processing Technology Research Group; Lappeenranta Finland
Antti Salminen, Machine Technology Centre Turku Ltd.; Turku Finland
Presented at ICALEO 2010

Laser microprocessing is one of the fastest spreading and developing areas of all laser processes in the world. In the wide field of micromachining the...

ICALEO 2010 Paper #M706 (Micromachining of Glassy Carbon Toolsets for Micro Embossing Applications)

Micromachining of Glassy Carbon Toolsets for Micro Embossing Applications
Authors:
Pranav Chopra, Institute for Manufacturing, University of Cambridge; Cambridge Great Britain
Kun Li, Institute for Manufacturing, University of Cambridge; Cambridge
William O'Neill, Institute for Manufacturing, University of Cambridge; Cambridge Great Britain
Jack Gabzdyl, Spi Laser; Southampton Great Britain
Presented at ICALEO 2010

Glassy carbon materials offer advantages in the application of toolsets for micro embossing due to their particular material properties of high hardness, high operating temperatures and high chemical inertness. Such properties also render them...

ICALEO 2010 Paper #M801 (Laser Micromachining of Silicon Substrates: Investigation and Utilisation of Assist Media (Invited Presentation))

Laser Micromachining of Silicon Substrates: Investigation and Utilisation of Assist Media (Invited Presentation)
Authors:
Alan Conneely, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; Galway Ireland
Sedao -, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; -
Natalie Haustrup, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; -
Gerard OConnor, National Centre of Laser Applications, School of Physics, National University of Ireland Galway; -
Presented at ICALEO 2010

The use of Short and Ultrashort pulse lasers...

ICALEO 2010 Paper #M802 (3D-Microstructuring of Sapphire using High Power Fs-Laser Radiation and Selective Etching)

3D-Microstructuring of Sapphire using High Power Fs-Laser Radiation and Selective Etching
Authors:
Maren Hörstmann-Jungemannn, Lehrstuhl Fuer Lasertechnik (LLT), RWTH Aachen University; Aachen Germany
Jens Gottmann, Lehrstuhl Fuer Lasertechnik (LLT), RWTH Aachen University; Aachen Germany
Presented at ICALEO 2010

Micro structuring of sapphire and fused silica is an important market e.g. for microfluidic devices and sensors that combine optical and microfluidic features, freeform microlense systems as well as micromechanical parts. New techniques which enable more material and time efficient processing of sapphire and fused silica are requested.
The In-volume Selective Laser Etch...

ICALEO 2010 Paper #M804 (Laser Scribing of Stainless Steel with and Without Work Media)

Laser Scribing of Stainless Steel with and Without Work Media
Authors:
Anna Unt, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
Heidi Piili, PRESENTER NOT AUTHOR, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
Marika HirvimäKi, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta Finland
Matti Manninen, Lappeenranta University of Technology, Laser Processing Technology Research Group, Faculty of Technology; Lappeenranta
Antti Salminen, L...

ICALEO 2010 Paper #M901 (Micro-Cutting with Nanosecond Pulsed Fiber Lasers)

Micro-Cutting with Nanosecond Pulsed Fiber Lasers
Authors:
Jack Gabzdyl, Spi Lasers UK Limited; Southampton Great Britain
Mark Brodsky, SPI Lasers LLC; Santa Clara CA USA
Presented at ICALEO 2010

Nanosecond pulsed fiber lasers have made a significant impact in the material marking arena, but as laser sources they are proving to be extremely versatile finding many applications in a variety of micro-machining processes. One such process is micro-cutting.

Until recently high precision micro cutting has been the domain of DPSS pulsed lasers and CW-M fiber lasers, as epitomised by applications such as electronic stencil and medical stent cutting. However the short high peak power pul...

ICALEO 2010 Paper #M902 (High Speed Laser Cutting of Electrodes for Advanced Batteries)

High Speed Laser Cutting of Electrodes for Advanced Batteries
Authors:
Jyoti Mazumder, University of Michigan; Ann Arbor MI USA
Mehrdad Iravani, University of Michigan; Ann Arbor
Hans Herfurth, Fraunhofer Usa; Plymouth MI USA
Henrikki Pantsar, Fraunhofer Usa; Plymouth MI USA
Rahul Patwa, Fraunhofer USA; PLYMOUTH MI USA
Stefan Heinemann, Fraunhofer Usa; Plymouth MI USA
Presented at ICALEO 2010

Lithium-ion batteries are at the forefront of current advanced battery technology development for Hybrid-Electric Vehicles. While first vehicles with Li-ion batteries are entering the market, it is understood that significant technology adv...