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ICALEO 2005

210 Products.
Page: 1, 2, 3, 4, 5, 6, 7, 8, 9

ICALEO 2005 Paper #M103 (Laser Processing of Optical Materials: Drilling, Dicing and Modifying Thin Glass (Invited Paper))

ICAL05_M103

Laser Processing of Optical Materials: Drilling, Dicing and Modifying Thin Glass (Invited Paper)
Authors:
David Ashkenasi, LMTB; Berlin Germany
Presented at ICALEO 2005

Laser processing of optical materials is becoming increasingly important. In addition to infrared CO2-laser stress-related dicing of float glass, applications using DPSSL lasers are slowly coming into focus of attention. Utilizing non-linear absorption channels, ns-pulsed green (532nm) laser light can actually drill and cut glass in different thickness, depending on fluence, feed rate and pulse width. This characterizes a very interesting processing alternative for certain types of optical materials and/or geometric conditions, ...

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ICALEO 2005 Paper #M105 (New Ultrafast High-Energy Laser Concepts and their Applications)

ICAL05_M105

New Ultrafast High-Energy Laser Concepts and their Applications
Authors:
Wolfgang Seitz, High Q Laser (US), Inc.; Watertown MA USA
Alexander Killi, Max-Planck-Institut f�r Kernphysik; Heidelberg Germany
Heinz Huber, High Q Laser Production GmbH; Hohenems Austria
Max Lederer, High Q Laser Production GmbH; Hohenems Austria
Uwe Morgner, Max-Planck-Institut f�r Kernphysik; Heidelberg Germany
Presented at ICALEO 2005

Ultrafast laser systems with pulse durations in the femto- and picosecond regime have proven their potential in several material processing applications. So far, a lot of these applications have been limited by the costly and difficult...

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ICALEO 2005 Paper #M106 (Research on Direct Laser Patterning of Thin Films for Flat-panel Display)

ICAL05_M106

Research on Direct Laser Patterning of Thin Films for Flat-panel Display
Authors:
Reo Usui, Osaka University; Minoh, Osaka Japan
Ryohei Satoh, Osaka University; Suita, Osaka Japan
Haruyoshi Iwata, Osaka University; Suita, Osaka Japan
Koji Nakagawa, Osaka University; Suita, Osaka Japan
Eiji Morinaga, Osaka University; Suita, Osaka Japan
Satoru Takaki, Osaka University; Osaka, Suita Japan
Presented at ICALEO 2005

On a microcircuit pattern, which is necessary for fabricating electrical devices such as plasma display and liquid crystal display, the wet process which utilizes lithography technology is commonly employed. The wet process...

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ICALEO 2005 Paper #M107 (Patterning of ITO Film by Femtosecond Laser Ablation)

ICAL05_M107

Patterning of ITO Film by Femtosecond Laser Ablation
Authors:
Dave Farson, Ohio State University; Columbus OH USA
Hae Choi, Ohio State University; Columbus OH USA
Kwang Kim, LG Electronics; Pyungtaek-si Kyunggi-Do Korea
Presented at ICALEO 2005

Indium tin oxide (ITO) is commonly used in flat panel display applications. The ITO needs to be patterned to form pixels and direct write laser ablation is widely used for this purpose. In this investigation, femtosecond laser patterning of ITO was studied to identify laser processing parameters which cleanly ablated ITO with a minimum of damage to substrate glass and surrounding ITO. Soda-lime glass with an ITO film of approxim...

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ICALEO 2005 Paper #M108 (Marking Glass with Continuous and Pulsed CO2 Laser Radiation)

ICAL05_M108

Marking Glass with Continuous and Pulsed CO2 Laser Radiation
Authors:
Ana Rolo, INETI-DOP; Lisboa Portugal
Jo�o Coelho, INETI-DOP; Lisbon Portugal
Margarida Pires, INETI-DOP; Lisbon Portugal
Presented at ICALEO 2005

Although industrial laser systems for marking different types of glass are already commercially available, the interaction process between laser radiation and the glass material, and the role of process and material parameters is not yet fully understood. In this work the influence of average power and temporal parameters of a pulsed CO2 laser such as pulse length, duty cycle and pulse period, on the actual process of laser marking, like surface crazing, m...

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ICALEO 2005 Paper #M201 (High Power DPSS Laser Micromachining of Silicon And Stainless Steel for Device Singulation)

ICAL05_M201

High Power DPSS Laser Micromachining of Silicon And Stainless Steel for Device Singulation
Authors:
Martyn Knowles, Oxford Lasers Ltd.; Abingdon, Oxon Great Britain
Presented at ICALEO 2005

We describe recent high power diode-pumped solid-state (DPSS) laser micromachining results of commonly used industrial materials such as silicon and stainless steel. Frequency upconverted lasers were used at 532nm and 355nm. Increasing demand for high volume production of miniaturised devices for precision applications has recently placed much emphasis on ultrafast laser micromachining of these materials. Nevertheless industrially robust high power nanosecond DPSS lasers are shown to compete well resultin...

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ICALEO 2005 Paper #M202 (UV-Micromachining by Excimer Laser)

ICAL05_M202

UV-Micromachining by Excimer Laser
Authors:
Rainer Paetzel, Lambda Physik AG; Goettingen Germany
Presented at ICALEO 2005

With the trend to ever smaller feature the use UV-wavelength for micromachining and microstructuring applications in microelectronics- and semiconductor industry is steadily increasing. The use of excimer laser in combination with optimized UV-beam delivery systems presents the direct path to micromachining with highest resolution. Recent advances in excimer laser technology have greatly reduced the maintenance effort by extension of the gas lifetime and laser tube lifetime. With these new performance levels of advanced excimer laser and highly efficient UV-beam delivery sys...

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ICALEO 2005 Paper #M203 (Effect of Beam Angle on Heat Affected Zone, Recast and Oxide Layer in Laser Drilling of Thermal Barrier Coated Nickel Alloys)

ICAL05_M203

Effect of Beam Angle on Heat Affected Zone, Recast and Oxide Layer in Laser Drilling of Thermal Barrier Coated Nickel Alloys
Authors:
Kursad Sezer, The University of Manchester; Manchester UK
Lin Li, The University of Manchester; Manchester UK
Ben Anderson, Rolls-Royce Plc; Derby UK
Paul Williams, Rolls-Royce Plc; Derby UK
Mark Schmidt, The University of Manchester; Manchester Great Britain
Presented at ICALEO 2005

Industrial applications of laser drilling include the production of cooling holes at acute angles in certain parts of the aero-engine components. These parts are usually covered with Thermal Barrier Coatings (TBC) to protect them f...

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ICALEO 2005 Paper #M204 (Feasibility Study of Laser Ablation using Long-Pulsed, 300w, Cw Single-Mode Fiber Laser)

ICAL05_M204

Feasibility Study of Laser Ablation using Long-Pulsed, 300w, Cw Single-Mode Fiber Laser
Authors:
Jay Tu, North Carolina State Univ.; Raleigh NC USA
Jason Dilwith, North Carolina State University; Raleigh NC USA
Wm. Harp, North Carolina State University; Raleigh NC USA
Presented at ICALEO 2005

Traditionally, nano-second, pico-second, and femto-second pulsing lasers are used for micro-hole drilling. Using the ultra-short pulse duration, extremely high peak powers can be achieved for laser ablation to drill holes. In this study, we examine the use of a 300W CW fiber laser operated in a modulated mode for micro-hole drilling. As the CW power of this fiber laser is extr...

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ICALEO 2005 Paper #M205 (Optical Trepanning by Using Axcion Lenses)

ICAL05_M205

Optical Trepanning by Using Axcion Lenses
Authors:
Danyong Zeng, College of Optics and Photonics, University of Central Florida; Orlando FL USA
W.P. Latham, Air Force Research Labortatory, Directed Energy Directorate; Kirtland Air Force Base NM USA
P.F. Jacobs, Laser Fare Inc.; Smithfield NM USA
Aravinda Kar, College of Optics and Photonics, University of Central Florida; Orlando FL USA
Presented at ICALEO 2005

Percussion drilling and trepanning are two laser drilling methods. Circular laser spots are generally used in conventional laser drilling. Annular laser beams provide a new laser drilling mechanism. When an annular beam is focused on the workpiece s...

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ICALEO 2005 Paper #M206 (Water-Jet Guided Fiber Lasers for Mask Cutting)

ICAL05_M206

Water-Jet Guided Fiber Lasers for Mask Cutting
Authors:
Delphine Perrottet, Synova SA; Ecublens Switzerland
Bernold Richerzhagen, Synova SA; Ecublens Vaud Switzerland
Tom Levesque, Synova US; Lewisville TX USA
Presented at ICALEO 2005

The water jet guided laser technology is an innovative process which combines a laser beam and a hair thin water jet by focusing a laser beam through a pressurized water chamber into a nozzle. The water jet emitted from the nozzle guides the laser beam by means of total internal reflection at the water/air interface, in a manner similar to conventional glass fibers. This technology is well suited for micro machining mainly because it gene...

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ICALEO 2005 Paper #M207 (Microshaping of Densely Sintered Zirconia Ceramic Using Femtosecond Lasers)

ICAL05_M207

Microshaping of Densely Sintered Zirconia Ceramic Using Femtosecond Lasers
Authors:
Kristian Werelius, Johann Wolfgang Goethe University Frankfurt; Frankfurt/Main Germany
Niko Baersch, Laser Zentrum Hannover e.V.; Hannover Germany
Fernando Liebana, Laser Zentrum Hannover e.V.; Hannover Germany
Stephan Barcikowski, Laser Zentrum Hannover e.V.; Hannover Germany
Uwe Stute, Laser Zentrum Hannover e.V.; Hannover Germany
Andreas Ostendorf, Laser Zentrum Hannover e.V.; Hannover Germany
Presented at ICALEO 2005

For dental restorations, very dense and hard ceramics - especially hot isostatically pressed forms of zirconia ceramics like HIP ...

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ICALEO 2005 Paper #M208 (Effect of Recombination on Ultrashort Pulse Laser Material Removal by Coulomb Explosion)

ICAL05_M208

Effect of Recombination on Ultrashort Pulse Laser Material Removal by Coulomb Explosion
Authors:
Rohit Viegas, University of Arizona; Tucson AZ USA
Cho Lik Chan, University of Arizona; Tucson AZ USA
Presented at ICALEO 2005

The femtosecond laser material interaction takes place on a very short time scale. The transfer of energy from the pulse to the material cannot be described using thermal concepts as these are based on a time scale which is much longer than that during femtosecond pulse interaction. Therefore the femtosecond pulse may be considered as an intense electromagnetic wave. When a ultra short laser pulse impinges a semiconductor, the atoms are ionized by two processes ...

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ICALEO 2005 Paper #M209 (Laser Micro Adjustment � From New Basic Process Knowledge to the Application)

ICAL05_M209

Laser Micro Adjustment � From New Basic Process Knowledge to the Application
Authors:
Michael Schmidt, BLZ Bayerisches Laserzentrum GmbH; Erlangen BY Germany
Maik Zimmermann, Bayerisches Laserzentrum gGmbH; Erlangen Germany
Manfred Dirscherl, BLZ Bayerisches Laserzentrum GmbH; Erlangen Bavaria Germany
Matthias Rank, Bayerisches Laserzentrum gGmbH; Erlangen Germany
Presented at ICALEO 2005

Laser micro bending and its controlled variant, laser micro adjustment are known for many years. Different theories on the working principle depending on interaction time and energy flux density have been evolved and experimentally proven. The temperature gradient mechani...

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ICALEO 2005 Paper #M210 (Direct Micro Laser Cladding with Microscale Nanophased Powders)

ICAL05_M210

Direct Micro Laser Cladding with Microscale Nanophased Powders
Authors:
Peter Stippler, Laser Zentrum Hannover; 30419 Hannover Germany
Andreas Ostendorf, Laser Zentrum Hannover; 30419 Germany
Oliver Meier, Laser Zentrum Hannover; 30419 Hannover Germany
Stefan Czerner, microLS; Hannover Germany
Presented at ICALEO 2005

A manufacturing method is shown based on the most advanced small scale laser cladding technology able to shape solid metallic objects being composed of nanophased powders. New development in powder feeding will be illustrated being able to feed micro particles using combination of brush feeder and ultrasonic vibration. For gradient components...

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ICALEO 2005 Paper #M302 (Micro Welding of Thin Metals with Low Power Pulsed Nd:YAG laser)

ICAL05_M302

Micro Welding of Thin Metals with Low Power Pulsed Nd:YAG laser
Authors:
Mohammed Naeem, GSI Lumonics; Rugby Great Britain
Presented at ICALEO 2005

The primary drivers in Microtechnology are getting smaller in size, increased sophistication and complexity, greater local intelligence, increased predication of in-service reliability and lower cost. These trends result in the need for new materials and assembly technologies and are consequently the adoption of pulsed laser as production tools. In order to adapt the processing speed to the average laser power pulsed laser operation is desirable. Currently some welding applications require very small spot size (30-40�m) and pulse energies low as 10m...

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ICALEO 2005 Paper #M303 (Electron Beam Welding vs. Laser Beam Welding for Air Bearing Shaft)

ICAL05_M303

Electron Beam Welding vs. Laser Beam Welding for Air Bearing Shaft
Authors:
Mohammed Naeem, GSI Lumonics; Rugby Great Britain
Presented at ICALEO 2005

Air bearings allow designers to push the envelope on precision and high-speed applications. Unlike contact roller bearings, air bearings utilise thin film pressurised air to provide �zero friction� load bearing interface between surfaces that would otherwise be in contact with each other. Being non-contact, air bearings avoid the tradition bearing- related problems of friction, wear, and lubricant handling, and offer distinct advantages in precision positioning and high speed applications. Air bearings are a natural choice for applications in coo...

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ICALEO 2005 Paper #M304 (Laser-Assisted Imprinting of Self-Assembled Nanostructures)

ICAL05_M304

Laser-Assisted Imprinting of Self-Assembled Nanostructures
Authors:
Hao Wang, University of Nebraska-Lincoln; Lincoln NE USA
Yongfeng Lu, University of Nebraska-Lincoln; Lincoln NE USA
D.R. Alexander, University of Nebraska-Lincoln; Lincoln NE USA
D.W. Doerr, University of Nebraska-Lincoln; Lincoln NE USA
K. Mendu, University of Nebraska-Lincoln; Lincoln NE USA
Presented at ICALEO 2005

Nanoscale structuring is a promising area in which the easiest and effective processing methods are being developed. Based on the advantage of laser, associated with improved self-assembly technique, it is very effective to fabricate nanoscale structures, such a...

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ICALEO 2005 Paper #M401 (Realization of Precision Shaped-Hole Drilling Using Ultra-Fast Lasers (Invited Paper))

ICAL05_M401

Realization of Precision Shaped-Hole Drilling Using Ultra-Fast Lasers (Invited Paper)
Authors:
Chen-Hsiung Cheng, Panasonic Boston Laboratory; Cambridge MA USA
Xinbing Liu, Panasonic Boston Laboratory; Cambridge MA USA
Presented at ICALEO 2005

Recently we developed the technique of using ultra-fast laser for shaped-hole fabrication in industrial applications. In particular, inkjet nozzles of funnel shape can be fabricated reproducibly, precisely and in high speed using the ultra-fast laser fabrication technique. A PC-controlled scanning mirror is used to steer laser beam and form an overlapped two-dimensional tool path. Laser beam is repetitively scanned over the target area of the...

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ICALEO 2005 Paper #M402 (Direct Writing of Buried Waveguides in Hybrid Organic-Inorganic Sol-Gel by Femto-Second Laser Pulses)

ICAL05_M402

Direct Writing of Buried Waveguides in Hybrid Organic-Inorganic Sol-Gel by Femto-Second Laser Pulses
Authors:
David K.Y. Low, Singapore Institute of Manufacturing Technology; Singapore
Xiao Zhang, Singapore Institute of Manufacturing Technology; Singapore
Hong Xie, Singapore Institute of Manufacturing Technology; Singapore
Z.L. Li, Singapore Institute of Manufacturing Technology; Singapore Singapore
GC Lim, Singapore Institute of Manufacturing Technology; Singapore
S.K. Pani, Nanyang Technological University; Singapore
C.C Wong, Nanyang Technological University ; Singapore
Presented at ICALEO 2005

Using 77...

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ICALEO 2005 Paper #M403 (Processing of Polymers by UV Picosecond Lasers)

ICAL05_M403

Processing of Polymers by UV Picosecond Lasers
Authors:
Gediminas Raciukaitis, Institute of Physics; Vilnius Lithuania
Mindaugas Gedvilas, Institute of Physics; Vilnius Lithuania
Presented at ICALEO 2005

UV laser radiation is widely used for processing of polymers. We present the results obtained by investigation of the laser ablation processes with picosecond pulses in about 20 different organic materials. Micro-drilling and cutting of polymers were performed by the 266-nm radiation. The effect of laser fluence on the ablation rate and drilling depth was investigated.
Most of the materials showed two ablation thresholds. One of them was below 1 J/cm2 with a low material removal ...

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ICALEO 2005 Paper #M405 (Effect of Ionization on Femtosecond Laser Pulse Propagation in Silicon)

ICAL05_M405

Effect of Ionization on Femtosecond Laser Pulse Propagation in Silicon
Authors:
Huayu Li, Michigan State University; East Lansing Michigan USA
Hyungson Ki, Michigan State University; East Lansing MI USA
Presented at ICALEO 2005

In this article, femtosecond laser pulse propagation in a silicon target is simulated by considering the ionization process under intense electromagnetic field of the laser pulse. The electromagnetic field is computed by solving the Maxwell�s equations using the Finite-Difference Time-Domain method, and the two-temperature model is employed for electron-lattice energy coupling phenomena. The electrical conductivity is predicted by computing the electron a...

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ICALEO 2005 Paper #M406 (Femtosecond Bulk Laser Micromachining of Microfluid Channels in PMMA)

ICAL05_M406

Femtosecond Bulk Laser Micromachining of Microfluid Channels in PMMA
Authors:
Dave Farson, Ohio State University; Columbus OH USA
Chun Lu, Ohio State University; Columbus OH USA
Hae Choi, Ohio State University; Columbus OH USA
Presented at ICALEO 2005

Bulk machining of transparent materials is an interesting capability of offered by short pulse lasers. When a laser beam with high peak pulse power is focused inside of a transparent material, the material becomes vaporized and ionized by the laser energy and its expansion causes a small pore to form at the interaction site. By translating the beam so that multiple pores are connected, microfluidic passages can be machin...

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ICALEO 2005 Paper #M407 (Ultrashort Pulse Laser Micromachining Performance Enhancements)

ICAL05_M407

Ultrashort Pulse Laser Micromachining Performance Enhancements
Authors:
Benjamin Campbell, Penn State Electro-Optics Center; Freeport PA USA
Jeffrey Thomas, Penn State Electro-Optics Center; Freeport PA USA
Vladimir Semak, Penn State Electro-Optics Center; Freeport PA USA
Presented at ICALEO 2005

Lasers have long been promised to be a revolutionary technology for manufacturing, but have not yet achieved the anticipated market penetration. Major hurdles still exist in bringing new technologies, such as ultrashort pulse lasers, to the manufacturing floor, the first being easily repeatable, high quality laser micromachining. We explored methods to improve the spatial an...

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ICALEO 2005 Paper #M408 (Microstructuring Using Femtosecond Pulsed Laser Ablation)

ICAL05_M408

Microstructuring Using Femtosecond Pulsed Laser Ablation
Authors:
Max Groenendijk, University of Twente; Enschede Netherlands
Presented at ICALEO 2005

A self-induced mechanism leading to the formation of periodic microstructures has been observed during femtosecond pulsed laser ablation with a high repetition laser source. The bottom of an ablated area, machined by the direct write method, shows two different kinds of microstructures. Dependant on the process parameters, a periodic ripple or a pillar structure emerges. The parameters leading to these phenomena have been identified as well as the possible variations in aspect ratios and feature sizes. Furthermore the application of such structur...

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210 Products.
Page: 1, 2, 3, 4, 5, 6, 7, 8, 9

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